AI Server PCBA Assembly 1-32 Layer Turnkey Service with Quick Prototyping Including Testing
High-speed PCB assembly solutions for AI computing and data center hardware. Supports: High TG materials High-speed routing Large BGA assembly
Orderquantity
Prototype to Mass Production
Surfacefinish
HASL, ENIG, OSP, Immersion Silver, Immersion Tin
Materials
FR4, Rogers, Aluminum, Flexible PCB materials
Packaging Details
Anti-static + bubble wrap + cardboard box
Supply Ability
1000000PCS
Qualitystandards
ISO9001, IPC Class 2 & 3
Product Description
High-speed PCB assembly solutions for AI computing and data center hardware.
Supports:
- High TG materials
- High-speed routing
- Large BGA assembly
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