China Embedded Control HDI ENIG Gold Finish PCBA Assembly Turnkey Service with Quick Manufacturing Including Testing for sale

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Embedded Control HDI ENIG Gold Finish PCBA Assembly Turnkey Service with Quick Manufacturing Including Testing

Name: Embedded Control HDI ENIG Gold Finish PCBA Assembly Turnkey Service with Quick Manufacturing Including Testing
Brand: Shenzhen Jingchengjie Technology Co., Ltd.

High-Density HDI Multi-Layer Embedded Control Board - Gold Finish Complexity: This board features a high-density SoC/FPGA BGA design, surrounded by 0201 passive components, requiring extreme precision in SMT placement. Interconnect Technology: Utilizes advanced HDI (High-Density Interconnect) with blind and buried vias to manage complex signal routing in a compact form factor. Interface Rich: Integrated with multiple FPC/FFC connectors (J10-J26), SIM/MicroSD slots, and high

Place of Origin Shenzhen, China

BGA Pitch / BGA Min 0.35mm Pitch

Min Trace/Space 2.5mil

Packaging Details Vacuum packaging+Cardboard box

Inspection 100% AOI + X-Ray

Component Size 0201 (0.6mm x 0.3mm)

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Product Description

High-Density HDI Multi-Layer Embedded Control Board - Gold Finish

Complexity: This board features a high-density SoC/FPGA BGA design, surrounded by 0201 passive components, requiring extreme precision in SMT placement.

Interconnect Technology: Utilizes advanced HDI (High-Density Interconnect) with blind and buried vias to manage complex signal routing in a compact form factor.

Interface Rich: Integrated with multiple FPC/FFC connectors (J10-J26), SIM/MicroSD slots, and high-speed display interfaces.

Feature	QHPCBA (Factory‑Direct)	Generic Platforms
Response Time	Direct Engineering Review	12‑24h Customer Support Ticket
Production Speed	8 Hours (SMT)	3‑7 Days (Standard)
Middleman Markup	0% (Factory Pricing)	Platform Commission Fees
DFM Feedback	Active & Collaborative	Automated "Reject"
Facility Access	Visit Our Shenzhen Factory	Virtual/Office Address

Manufacturing Excellence at QHPCBA

Our factory specializes in the rapid prototyping of complex HDI boards, ensuring structural integrity and signal fidelity.

Ultra-Precision Stencil (2-Hour): Custom laser-cut stencils with nano-coating options for perfect BGA solder release.

Rapid PCB Fabrication (24-48H): Specialized supply chain for multi-layer HDI prototyping.

Expert SMT Assembly (8-Hour): Equipped with high-speed Yamaha/Pana-sonic mounters capable of 01005 component placement and X-Ray BGA inspection.

Quality Control

X-Ray Inspection: 100% inspection for BGA & QFN internal soldering.
AOI Testing: Full automated optical inspection for all SMT components.
Impedance Control: Strict tolerance matching for high-speed differential pairs.