6 Layer Embedded Control Multilayer PCB Board With Immersion Gold

Name: 6 Layer Embedded Control Multilayer PCB Board With Immersion Gold
Brand: Shenzhen Xunsiwei Circuit Co., Ltd.

6-layer immersion gold embedded control PCB board Key Specifications Layer Count 6 Material FR4 TG150 Board Thickness 1.6mm Copper Thickness 1/1/1/1/1/1 oz Minimum Hole Size 0.2 mm three sides Minimum Line Width 0.12 mm Minimum Line Spacing 0.12 mm Solder Mask Color Green Surface Finish ENIG Application Field Embedded Control Product Product Description: Lamination & Material Selection Focus Area Specific Requirements Substrate High-Tg FR-4 (Tg ≥ 150°C, 170°C recommended),

Place of Origin China

Minimum Line Width 0.12 mm

Copper Thickness 1/1/1/1/1/1 oz

Material FR4 TG150

Model Number XSWPCB

Minimum Line Spacing 0.12 mm

remote control helicopter avatar plastic gold pan laser pointer with green light

Product Description

6-layer immersion gold embedded control PCB board

Key Specifications

Layer Count	6
Material	FR4 TG150
Board Thickness	1.6mm
Copper Thickness	1/1/1/1/1/1 oz
Minimum Hole Size	0.2 mm three sides
Minimum Line Width	0.12 mm
Minimum Line Spacing	0.12 mm
Solder Mask Color	Green
Surface Finish	ENIG
Application Field	Embedded Control Product

Product Description:

Lamination & Material Selection

Focus Area	Specific Requirements
Substrate	High-Tg FR-4 (Tg ≥ 150°C, 170°C recommended), low moisture absorption, good heat resistance
Copper Foil Thickness	Signal layer: 0.5oz ~ 1oz; Power/GND layer: 1oz ~ 2oz; High-current paths: ≥ 2oz
Lamination Symmetry	Multilayer stack-up must be symmetrical to prevent board warpage

Design for Manufacturing (DFM)

Focus Area	Recommended Design Value	Typical Minimum Capability
Trace Width/Spacing	≥ 6mil	4mil
Via Hole Diameter	0.3mm (signal), 0.4~0.5mm (power)	0.2mm (laser), 0.3mm (mechanical)
Pad Size	0.1~0.2mm wider than pin	—
Silkscreen	Line width ≥ 5mil, keep clear of pads and vias	—
Test Points	Reserve on critical signals and power nets; spacing ≥ 1.27mm

Technical Specifications

Item	Mass Production Capability	Extreme Capability
Board Thickness Range	0.3~6.0mm	0.3~6.0mm
Exposure Alignment Accuracy	±0.015mm	±0.005mm
Minimum Annular Ring	Single side ≥0.05mm	Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper)	0.05mm / 0.05mm	0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper)	0.05mm / 0.05mm	0.05mm / 0.05mm
Min Line Width/Space (1oz base copper)	0.075mm / 0.075mm	0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1/2oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1oz base copper)	±0.0075mm	±0.0075mm
Gold Finger Total Pitch Tolerance	<30mm: ±0.05mm 30~60mm: ±0.075mm	<30mm: ±0.03mm 30~60mm: ±0.05mm