Precision Communication PCB For Wireless Module Integration & Iot Connectivity Solutions
Precision Communication PCB Tailored for integration into wireless communication modules and IoT connectivity solutions Product Specifications Layer Count 4L Material FR4-TG140 Board Thickness 1.6 MM Copper Thickness 1/1/1/1 oz Minimum Hole Size 0.2 mm Minimum Line Width 0.12 mm Minimum Line Spacing 0.1 mm Solder Mask Color Blue Surface Finish ENIG (Electroless Nickel Immersion Gold) Application Field Communication Products Key Features: 4-layer PCB, 0.2mm BGA pitch, with
Tailored for integration into wireless communication modules and IoT connectivity solutions
| Layer Count | 4L |
| Material | FR4-TG140 |
| Board Thickness | 1.6 MM |
| Copper Thickness | 1/1/1/1 oz |
| Minimum Hole Size | 0.2 mm |
| Minimum Line Width | 0.12 mm |
| Minimum Line Spacing | 0.1 mm |
| Solder Mask Color | Blue |
| Surface Finish | ENIG (Electroless Nickel Immersion Gold) |
| Application Field | Communication Products |
We understand that the core of communication boards lies not in simple "layer count stacking," but in ensuring signal integrity under extreme precision scenarios. Xunsiwei focuses on BGA packaging and HDI technologies, providing deep solutions from design optimization to volume delivery for high-performance communications, IoT gateways, and intelligent electronic systems.
Our understanding of "customization" goes beyond simple dimensional modifications—it's about collaborative optimization starting from the design phase:
- DFM Pre-Assessment: Intervention during your layout and routing phase to anticipate potential risks in BGA fan-out, impedance stack-up, and gold finger tracing
- Special Process Combination Capability: Simultaneous realization of 0.2mm BGA + gold fingers + selective ENIG + impedance control on 4-layer boards, formed in one process—no secondary processing required
| Test Item | Industry Standard (Spot Check) | Xunsiwei Standard |
|---|---|---|
| Electrical Test | Flying probe spot check | 100% full inspection (flying probe + fixture), zero tolerance for open/short circuits |
| AOI Inspection | Outer layer only | Full-process AOI for inner and outer layers, no hiding place for fine line defects |
| Thermal Stress Test | 288℃/10S | 288℃/20S, 3 cycles, simulating extreme operating conditions |
| Impedance Consistency | First article confirmation | Batch sampling + SPC process control, CpK ≥ 1.33 |
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