Polyimide Base Substrates for FPC Manufacturing and Semiconductor Encapsulation & Packaging
Polyimide Base Substrates for FPC Manufacturing and Semiconductor Encapsulation & Packaging Detail Information Place of Origin: ANHUI, CHINA Certification: UL ISO ROHS Material: Polyimide Color: Yellow Treatment: Single-side / Both Sides Width: 514MM 520MM 1028MM 1040MM Thickness: 12.5μm 20μm 18μm 25μm Packing Style: Standard Packing Application: Roll Length: Customized Packaging Details: Wooden pallet Supply Ability: 2000 ton/year Highlight: High Thermally Conductive
Polyimide Base Substrates for FPC Manufacturing and Semiconductor Encapsulation & Packaging
Flexible Printed Circuit Base Film: High Dimensional Stability Polyimide
It boasts superior mechanical performance, ultra-low CTE and great surface adhesiveness. The product meets RoHS & REACH standards and is safety-certified by US UL Labs.
GL high-spec polyimide film mainly serves high-precision adhesive FCCL base materials, dimensionally stable coverlays, chip packaging and specialty adhesive tape substrates.
To ensure the longevity and performance of our Polyimide film, please adhere to the following guidelines:
- Shelf Life: 6 months from the date of manufacture.
- Storage Conditions:
· Store in a cool, dry place away from direct sunlight will be necessary.
· Avoid exposure to high humidity or extreme temperature fluctuations.
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