High-Reliability Copper-Polyimide Composites for Dynamic Bending Applications
High-Reliability Copper-Polyimide Composites for Dynamic Bending Applications Product Overview: The GL series polyimide substrates forge unprecedented performance benchmarks across the polyimide film sector. Leveraging in-house developed fabrication techniques, our product re-engineers the intrinsic molecular structure at the fundamental level. Compared with generic PI film goods, its core functional indicators such as tensile performance, dimensional stability and chemical
The GL series polyimide substrates forge unprecedented performance benchmarks across the polyimide film sector. Leveraging in-house developed fabrication techniques, our product re-engineers the intrinsic molecular structure at the fundamental level. Compared with generic PI film goods, its core functional indicators such as tensile performance, dimensional stability and chemical corrosion resistance see a more than 30% performance uplift.
- Outstanding Mechanical Strength
- Exceptional Dimensional Stability
- Superior Laminating Properties
- Conforms to RoHS and REACH regulations
- High-density flexible copper clad laminates (FCCL) for FPC fabrication
- Dimensionally stable coverlays for circuit protection
- Advanced encapsulation and packaging for semiconductor devices
- High-performance substrates for specialty adhesive tapes
To preserve the integrity and performance of our Polyimide film, please adhere to the following storage guidelines:
- Shelf Life: 6 months from the manufacturing date.
- Optimal Environment: Store in a cool, dry place with stable ambient conditions.
- Protection Measures: Keep the original packaging sealed and protect from direct sunlight, moisture, and extreme temperatures.
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