8 Layer HDI Multilayer PCB Board Assembly with Blind Vias Prototype
Full Turnkey Blind Hole HDI Multilayer PCB Board Prototype Assembly Attribute Value Product Name Multilayer PCB Layer Count 8 Technology HDI Blind Vias 1 Product Type Printed Circuit Board Prototype 1 8 Layer Multilayer HDI PCB With Blind Vias Printed Circuit Boards Prototype General Specifications Layer: 8 Material: FR4 Thickness: 2.0MM Surface finish: ENIG Special: Blind hole, L1-L2, L3-L4, L5-L6, vias filled and capped Board size: 2*6CM Solder mask: No Silk screen: White
Place of Origin
Shenzhen,China
Prototype
1
Packaging Details
Vacuun bag
Product Name
Multilayer PCB
Model Number
ONE-102
Supply Ability
1000000000pcs/mon
Product Description
Full Turnkey Blind Hole HDI Multilayer PCB Board Prototype Assembly
| Attribute | Value |
|---|---|
| Product Name | Multilayer PCB |
| Layer Count | 8 |
| Technology | HDI |
| Blind Vias | 1 |
| Product Type | Printed Circuit Board |
| Prototype | 1 |
8 Layer Multilayer HDI PCB With Blind Vias Printed Circuit Boards Prototype
General Specifications
Layer: 8
Material: FR4
Thickness: 2.0MM
Surface finish: ENIG
Special: Blind hole, L1-L2, L3-L4, L5-L6, vias filled and capped
Board size: 2*6CM
Solder mask: No
Silk screen: White
Delivery time: 10 days for sample and small/medium batch
Package Details: Inner packing: vacuum packing/plastic bag; outer packing: standard carton packing
Blind Vias Technology
Blind vias connect one outer layer with at least one inner layer. Each connection level requires a separate drill file. The aspect ratio (hole depth to drill diameter) must be ≤ 1. The smallest hole determines the maximum distance between outer and corresponding inner layers.
Key technologies: Microvia, Via-in-Pad
HDI Blind Vias PCB Features
HDI boards represent one of the fastest growing PCB technologies, featuring blind/buried vias and often microvias of ≤0.006 diameter. They offer higher circuitry density than traditional PCBs.
HDI Board Types
- Through vias from surface to surface
- With buried vias and through vias
- Two or more HDI layers with through vias
- Passive substrate with no electrical connection
- Coreless construction using layer pairs
- Alternate coreless constructions
Special HDI Technologies
- Edge plating for shielding and ground connection
- Minimum track width/spacing: ~40μm in mass production
- Stacked microvias (plated copper or conductive paste filled)
- Cavities, countersunk holes, or depth milling
- Multiple solder resist color options (black, blue, green, etc.)
- Low-halogen materials in standard and high Tg range
- Low-DK materials for mobile devices
- All industry-standard PCB surface finishes available
Note: For accurate quotation, please provide Gerber files (DXP format etc.) due to the specialized nature of blind vias PCBs.
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