China High Frequency 2 Layer Communication PCB 1OZ 35um for sale

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High Frequency 2 Layer Communication PCB 1OZ 35um

Name: High Frequency 2 Layer Communication PCB 1OZ 35um
Brand: ONESEINE TECHNOLOGY CO.,LTD

Communication HF PCB Circuit Board 1OZ 4mil 35um Small Batch Production Product Specifications Attribute Value Product Type Communication PCB Material High Frequency Layer Count 2 layer Copper Weight 1OZ Min Line Width 4mil Mechanical Rigid Rigid Feature Batch Customized Production Copper Weight 35um PCB Technical Details Application Products: Power Amplifier Number of layers: 2 Surface treatment: OSP Material: PTFE F4B PCB size: 180*50mm Outer line width/line spacing: 7/7mil

Min Line Width 4mil

Place of Origin Shenzhen,China

Packaging Details Vacuun bag

Mechanical Rigid Rigid

layer_count 2 layer

Model Number ONE-102

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Product Description

Communication HF PCB Circuit Board 1OZ 4mil 35um Small Batch Production

Product Specifications

Attribute	Value
Product Type	Communication PCB
Material	High Frequency
Layer Count	2 layer
Copper Weight	1OZ
Min Line Width	4mil
Mechanical Rigid	Rigid
Feature	Batch Customized Production
Copper Weight	35um

PCB Technical Details

Application Products: Power Amplifier
Number of layers: 2
Surface treatment: OSP
Material: PTFE F4B
PCB size: 180*50mm
Outer line width/line spacing: 7/7mil
Inner line width/line spacing: 5/5mil
Board thickness: 2.3mm
Minimum aperture: 0.6mm

Precision High-Frequency PCBs for Mission-Critical Communication Systems

Engineered for demanding signal integrity in 5G, RF, and satellite applications, our high-frequency PCBs deliver GHz+ performance with exceptional reliability.

Why Our PCBs Dominate Critical Communication Hardware

Ultra-Low Signal Loss: Rogers/Taconic laminates with Dk=2.0-10.6 & controlled ±1.5% impedance tolerance
1OZ Heavy-Copper Advantage: Enhanced current handling + thermal management for power amplifiers and base stations
Strict Handling Protocols: ESD-controlled environment | Vacuum-sealed packaging | Moisture-sensitive component (MSD) compliance
High-Frequency Expertise: 40+ layer builds | PTFE substrates | Laser-drilled microvias down to 0.1mm
Rigorous Testing: TDR analysis | Insertion loss measurements | Time-domain reflectometry

Applications We Enable

5G NR mmWave Antenna Arrays Satellite Communication Terminals Radar and Avionics Systems High-Speed Backplane Interconnects IoT Gateway RF Modules

Certified Reliability

ITAR Registered | ISO 9001:2015 | IPC-6012 Class 3 | RoHS 3.0 Compliant

High-Frequency PCB Design Considerations

Via Design: Vias can impact signal integrity at high frequencies. Our PCBs use techniques like back drilling or buried vias to minimize signal reflections and maintain signal integrity across layers.

Component Placement: Careful consideration is given to component placement to minimize signal path lengths, reduce parasitic capacitance and inductance, and optimize signal flow.

Shielding: To minimize electromagnetic interference (EMI) and RF leakage, our PCBs employ shielding techniques such as copper pours, ground planes, or metal shielding cans.

Industry Applications

Our high-frequency PCBs serve critical applications in wireless communication systems, aerospace, radar systems, satellite communication, medical devices, and high-speed data transmission.