High Frequency Telecom PCB Assembly SMT Surface Mount Prototype Board FR-4
High Frequency Low Loss Components Telecom PCB Assembly SMT Mounting Services ♦ What's Telecom PCB Assembly? Telecom PCB Assembly refers to the manufacturing and assembly of printed circuit boards (PCBs) specifically designed for telecommunications equipment, such as: 5G/4G base stations Fiber-optic networking devices Satellite communication systems Routers, switches, and modems RF (Radio Frequency) and microwave systems These PCBs require high
High Frequency Low Loss Components Telecom PCB Assembly SMT Mounting Services
♦ What's Telecom PCB Assembly?
Telecom PCB Assembly refers to the manufacturing and assembly of printed circuit boards (PCBs) specifically designed for telecommunications equipment, such as:
- 5G/4G base stations
- Fiber-optic networking devices
- Satellite communication systems
- Routers, switches, and modems
- RF (Radio Frequency) and microwave systems
These PCBs require high-frequency performance, signal integrity, and reliability to handle fast data transmission, low latency, and harsh operational environments.
♦ Features of Telecom PCBs:
1. High-Frequency Materials
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- Use low-loss laminates (e.g., Rogers, Teflon, or Isola) to minimize signal degradation at GHz frequencies.
- Controlled impedance traces to prevent signal reflection.
2. Multilayer & HDI (High-Density Interconnect) Designs
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- 8+ layers for complex routing.
- Microvias & blind/buried vias for compact, high-speed designs.
3. RF & Microwave Components
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- Antennas, amplifiers, filters, and MMICs (Monolithic Microwave ICs).
- Shielding to reduce electromagnetic interference (EMI).
4. Thermal Management
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- Metal-core PCBs (e.g., aluminum), heat sinks, or thermal vias to dissipate heat from high-power components.
5. Strict Compliance Standards
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- IPC-A-600, IPC-6012 (for reliability).
- RoHS, REACH (for environmental safety).
- FCC, CE, ITU-T (for telecom regulations).
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♦ Telecom PCB Assembly Process Characteristics
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Components: Select high-frequency low-loss materials (such as PTFE substrates), high-temperature resistant chips (-40℃~125℃), and RF components require 50Ω impedance matching.
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Manufacturing accuracy: patch accuracy ±0.025mm (normal ±0.05mm), support 01005 tiny components; laser drilling + micro-hole electroplating to achieve high-density wiring.
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Special processes:
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Impedance control: line/medium optimization, differential line impedance deviation within ±10%.
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Electromagnetic shielding: metal cover/conductive glue isolates radio frequency interference.
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Thermal management: heat sink/aluminum substrate conducts heat quickly to prevent chip overheating.
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♦ Technical Parameters
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PCB Assembly Capability |
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Item |
Normal |
Special |
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SMT Assembly |
PCB(used for SMT) specification |
Length and Width( L* W) |
Minimum |
L≥3mm, W≥3mm |
L＜2mm |
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Maximum |
L≤800mm, W≤460mm |
L ＞ 1200mm, W＞500mm |
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Thickness( T) |
Thinnest |
0.2mm |
T＜0.1mm |
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Thickest |
4 mm |
T＞4.5mm |
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SMT components specification |
Outline Dimension |
Min size |
0201(0.6mm*0.3mm) |
01005(0.3mm*0.2mm) |
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Max size |
200 * 125 |
200 * 125 |
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component thickness |
T≤15mm |
6.5mm＜T≤15mm |
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QFP,SOP,SOJ (multi pins) |
Min pin space |
0.4mm |
0.3mm≤Pitch＜0.4mm |
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CSP/ BGA |
Min ball space |
0.5mm |
0.3mm≤Pitch＜0.5mm |
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DIP Assembly |
PCB specification |
Length and Width( L* W) |
Minimum |
L≥50mm, W≥30mm |
L＜50mm |
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Maximum |
L≤1200mm, W≤450mm |
L≥1200mm, W≥500mm |
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Thickness( T) |
Thinnest |
0.8mm |
T＜0.8mm |
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Thickest |
3.5mm |
T＞2mm |
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- On-time Delivery:
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- Owned PCBA factories 15,000 ㎡
- 13 fully automatic SMT lines
- 4 DIP assembly lines
2. Quality Guaranteed:
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- IATF, ISO, IPC, UL standards
- Online SPI, AOI, X-Ray Inspection
- The qualified rate of products reach 99.9%
3. Premium Service:
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- 24H reply your inquiry
- Perfect after-sales service system
- From prototype to mass production
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