High Precision Multi Head Chip Mounter Machine For Optical Modules Driver Modules
Equipment Applications Optical modules, HDMI/USB connectors, sensors, optical devices, light source modules, driver modules, etc. Highlights High-Precision Assembly: Equipped with SP-grade silent linear guides with a straightness tolerance of within 2 μm (measured by dial indicator). Adopts system laser interferometer motion compensation technology, featuring a positioning accuracy of ±0.8 μm and a repeat positioning accuracy of ±0.4 μm. Capable of achieving fast and high
Brand Name
UW
Payment Terms
T/T
Price
Negotiation
PR System
256 grayscale levels / edge detection
Standard Track Width
40-90mm
Minimum Order Quantity
1set
Product Description
Equipment Applications
Optical modules, HDMI/USB connectors, sensors, optical devices, light source modules, driver modules, etc.
Highlights
- High-Precision Assembly: Equipped with SP-grade silent linear guides with a straightness tolerance of within 2 μm (measured by dial indicator). Adopts system laser interferometer motion compensation technology, featuring a positioning accuracy of ±0.8 μm and a repeat positioning accuracy of ±0.4 μm. Capable of achieving fast and high-precision fixed-duration control of 6 pulses within 100 ms, ensuring consistent precision across batch-produced equipment and minimizing accuracy deviations caused by moving components.
- Reduced Misjudgment: The nozzle is configured with an independent micro-flow air circuit, enabling separate detection of each nozzle loop to reduce system misjudgment.
- Strong Compatibility: Compatible with both optical chip and electrical chip mounting processes.
- Professional Services: Supported by a dedicated vision technology team, which can customize efficient and accurate positioning solutions for various product types.
- Customization Services: A eutectic module can be added to upgrade the equipment into a eutectic die bonder.
Technical Parameters
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Parameter Name
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Parameter Value
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Production Cycle
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3s-12s
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Mounting Accuracy
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±3 ~ ±5μm@3σ
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Angular Accuracy
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±0.5° @3σ
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Chip Size
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0.15×0.15mm-5×5mm (Lens to be replaced per product requirements)
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Chip Thickness
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0.076-1mm(3-40mil, standard)minimum thickness down to 0.05mm(2mil,optional)
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Substrate Size
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L: 100-300mm；W: 40-90mm(Customization optional for widths below 40 mm)
H: 0.1-0.8mm(standard)0.8-2.0mm(optional)
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Magazine Size
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(To be provided by the customer according to product specifications)
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Wafer Size
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Compatible with 6–8 inch wafers (2-inch & 4-inch waffle packs)
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Automatic θ Calibration
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Range of ±15°
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Maximum Wafer Angle Correction
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360°
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Bonding Force
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20-300g
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Standard Track Width
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40-90mm
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PR System
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256 grayscale levels / edge detection
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Resolution
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1920pixel×2560pixel
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PR Accuracy
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5M(1920×2560pixel) FOV(16mm；×1,×2,×4)
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Angular Tolerance
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±0.1°
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Dimensions
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W: 1630mm; H: 1160mm; D: 1500mm (Subject to actual product)
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Weight
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1200KG (Subject to actual product)
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