10-Layer Multilayer PCB with 1OZ Copper Weight and 1200×6100mm Max Board Size - Custom Sample Services
Professional multilayer PCB featuring 10-layer construction, 1OZ outer copper weight, and maximum board size of 1200×6100mm. Offers white legend silkscreen, multiple soldermask colors, and compatibility with SMT/thru-hole assembly. Ideal for consumer electronics, automotive systems, and industrial applications requiring high-density interconnections.
Number Of Layer
10 Layers
Legend
White
Type Of Assembly
SMT And Thru-hole
Copper Thinknes
1 Oz
Material
FR-4, Polyimide, PTFE, Etc.
Solder Mask
Black
Product Description
Product Overview
Our multilayer printed circuit boards deliver exceptional quality and performance for demanding electronic applications. With professional custom sample services and 1OZ outer copper weight, these PCBs provide reliable platforms for complex electronic devices across various industries.
Key Specifications
Board Size: Up to 1200×6100mm
Layer Count: 10 layers (2-20 layers available)
Copper Thickness: 1 OZ outer copper weight
Board Thickness: 0.2mm to 6.0mm range
Layer Count: 10 layers (2-20 layers available)
Copper Thickness: 1 OZ outer copper weight
Board Thickness: 0.2mm to 6.0mm range
Core Features
- 10-layer construction for complex circuit designs
- White legend silkscreen for clear component identification
- Multiple soldermask colors: white, black, red, blue, yellow, purple
- High-precision manufacturing capabilities
- SMT and thru-hole assembly compatibility
- 0.1mm minimum silkscreen clearance
Technical Parameters
| Attribute | Value |
|---|---|
| Max Board Size | 1200×6100mm |
| Number of Layers | 2-20 |
| Assembly Type | SMT and Thru-hole |
| Copper Thickness | 1 OZ |
| Board Thickness | 0.2mm-6.0mm |
| Min. Silkscreen Clearance | 0.1mm |
Application Areas
- Consumer electronics and telecommunications devices
- Automotive systems and industrial machinery
- High-density interconnection applications
- Compact devices requiring 0.2mm-6.0mm thickness range
- Systems demanding optimal signal transmission and thermal management
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