Multi Layer High Frequency PCB with 3mil/3mil Line Spacing and 1oz-5oz Copper Weight for Communication Devices
High-frequency PCB with immersion silver surface finish, engineered for 1+ GHz applications. Features 3mil/3mil line width/spacing, flexible 1/2-4oz inner and 1-5oz outer copper layers, and multiple surface finish options. Ideal for 5G networks, satellite communications, and RF applications requiring superior signal integrity.
Origin
China
Final Foil
1 Oz
Place of Origin
China
Packaging Details
Carton
Tolerance
+/-10%
Certification
UL ISO IATF1
Product Description
Product Overview
Multi-layer high frequency PCB with immersion silver surface finish, engineered for superior performance in communication devices operating above 1 GHz. Manufactured with precision specifications including 3mil/3mil line width/spacing and flexible copper weight options.
Technical Specifications
| Parameter | Specification |
|---|---|
| Copper Weight (Inner Layers) | 1/2 Oz - 4oz |
| Copper Weight (Outer Layers) | 1oz - 5oz |
| Final Foil | 1 Oz |
| Minimum Line Width/Spacing | 3mil / 3mil |
| Tolerance | ±10% |
| Surface Finish Options | HASL, ENIG, Immersion Silver, OSP |
Key Features
High-Frequency Performance
Optimized for frequencies above 1 GHz with minimal signal loss and interference
Precision Manufacturing
3mil minimum line width and spacing for intricate circuit layouts
Flexible Copper Options
Inner layers 1/2-4oz, outer layers 1-5oz for optimal conductivity
Multiple Surface Finishes
HASL, ENIG, Immersion Silver, and OSP options available
Applications
- 5G network infrastructure and communication systems
- Satellite communications and aerospace electronics
- RF/microwave applications and automotive radar
- Medical devices and high-speed data processing equipment
Customization Services
Available customization includes surface finish selection (HASL, ENIG, Immersion Silver, OSP), copper weight specifications, and precision line width/spacing down to 3mil/3mil.
Technical Support
- Expert consultation on design and material selection for high-frequency applications
- PCB layout and stackup optimization for signal integrity
- Testing and validation services for performance compliance
- Troubleshooting assistance for high-frequency PCB issues
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