China Precision Chemical Etching Lead Frames with ±0.01mm Tolerance for Semiconductor Packaging for sale

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Precision Chemical Etching Lead Frames with ±0.01mm Tolerance for Semiconductor Packaging

Name: Precision Chemical Etching Lead Frames with ±0.01mm Tolerance for Semiconductor Packaging
Brand: Shenzhen Xinhaisen Technology Limited

High-precision chemical etched lead frames with ±0.01mm tolerance for semiconductor packaging applications. Available in copper, alloy 42, and stainless steel materials with gold, silver, tin, or nickel plating options. Ideal for automotive, medical, and consumer electronics requiring reliable mechanical support and electrical connectivity.

Design Limitations No Sharp Corners, No Undercuts

Place of Origin China

Materials Stainless steel, Titanium or customized

Surfacefinish Smooth, burr-free edges

Packaging Details PE bags and Carton

Model Number Customize

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Product Description

Precision Chemical Etching Lead Frames

Product Overview

Lead frames are precision-etched metal components designed for semiconductor packaging, providing essential mechanical support and electrical connectivity for integrated circuits. Our manufacturing process ensures exceptional accuracy with ±0.01mm tolerance control, delivering reliable performance for advanced electronic applications.

Key Features

High precision manufacturing with ±0.01mm tolerance
Wide material compatibility including copper, alloy 42, and stainless steel
Superior quality and durability for demanding applications
Rapid production capability for time-sensitive projects
Customization flexibility to meet specific design requirements

Technical Specifications

Parameter	Specification
Material Options	Copper, Alloy 42, Stainless Steel
Manufacturing Technique	Chemical Etching
Dimensional Tolerance	±0.01mm
Environmental Feature	Eco-Friendly Process
Plating Options	Gold, Silver, Tin, Nickel Plating
Minimum Order Quantity	Negotiable

Product Images

Precision chemical etched lead frame component for semiconductor packaging

High tolerance lead frame manufacturing process and quality control

Application Areas

Semiconductor Packaging: ICs, transistors, diodes
Consumer Electronics: Smartphones, wearables, IoT devices
Automotive Electronics: ECUs, sensors, power modules
Medical Devices: Implantable electronics, diagnostic equipment
Industrial & Aerospace: High-reliability control systems and communication hardware

Quality Assurance & Services

Quality Guarantee

Pre-production samples provided before mass production; final inspection conducted before shipment to ensure consistent quality standards.

Available Services

Delivery Terms: FOB, CFR, CIF, EXW | Payment Methods: T/T, Paypal, Western Union, Cash | Languages: English, Chinese

Packaging & Handling

Anti-static packaging for electronic components, vacuum-sealed layers to prevent oxidation of thin foils, comprehensive labeling with material certifications and laser-etched LOT numbers. Professional handling procedures including glove usage to maintain component integrity.