Precision Engineered Palladium Coated Copper Wire for in Semiconductor Device Packaging and Wire Interconnection
Palladium Coated Copper Bonding Wire Pd coated Copper wire is a winded,smooth surfaced, unpolluted bonding wire, ideal for wire bonding in IC semiconductor applications. It is available in thicknesses ranging from 18 to 25 microns and is fully compliant with the RoHS requirements of specific hazardous substance control. Key Advantages Enhanced bonding performance and stability Superior oxidation control on copper surface Extended HAST (Highly Accelerated Stress Test)
Pd coated Copper wire is a winded,smooth surfaced, unpolluted bonding wire, ideal for wire bonding in IC semiconductor applications. It is available in thicknesses ranging from 18 to 25 microns and is fully compliant with the RoHS requirements of specific hazardous substance control.
- Enhanced bonding performance and stability
- Superior oxidation control on copper surface
- Extended HAST (Highly Accelerated Stress Test) reliability
- Corrosion protection against halide attack from molding compounds
- Wider bonding parameter window
- High bonding reliability is obtained by stable palladium distribution to FAB surface layer
- High and stable stitch bondability
- Wide bonding window
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