High Precision Microfocus X-Ray Inspection Machine with CNC Batch Programming for PCB Testing

The S7200 X-Ray Inspection System is a high-performance, closed microfocusX-ray solution for non-destructive testing (NDT) of electronics, lithium batteries, and industrialcomponents, equipped with a Hamamatsu source and an ultra-high-definition iRay flatpanel detector. The system features automatic defect detection, CNC batch programming,and void/bubble analysis, making it ideal for BGA void analysis, PCB solder inspection, andaerospace component validation.

High-Resolution Microfocus Imaging
Equipped with a Hamamatsu sealed X-ray tube and 5-15um focal spot for ultra-fine defectdetection, ideal for BGA, IC, and PCB analysis.

Real-Time CNC Batch Inspection

Supports automated batch testing via CNC programming for repeatable, operator-freemeasurements with image storage and reporting.

Comprehensive Defect Analysis
Detects voids, cracks, solder bridges, and microbubbles with high accuracy; supports bubblerate calculation, distance, angle, area, and curvature measurement.

Smart Image Enhancement
Software enables on-the-fly adjustment of brightness, contrast, and gain, with user-definedpresets for repeat product testing.

Integrated Data Output
Inspection results exportable in CSV and image formats, enabling seamless documentation,traceability, and offline review.

Radiation Protection Compliance
Triple-layer steel-lead-steel shielding ensures emission below 0.5 Sv/h, exceedinginternational safety standards.

X-ray Inspection Image / Inspection Case Image

Specifications