Intelligent High Precision T9 SMT Solder Paste Printer 2D Check Solder Paste Printer
Intelligent High Precision T9 SMT Solder Paste Printer with 2D Check The T9 SMT solder paste printer is a full automatic screen printing machine designed for precise solder paste application on PCBs. This high-precision equipment ensures uniform solder paste distribution for optimal electronic component soldering in SMT production lines. Key Specifications Model T9 Machine Dimensions 1400(L) × 1630(W) × 1525(H) mm Weight Approx. 950Kg PCB Size Range Min: 50 × 50 mm | Max: 610
The T9 SMT solder paste printer is a full automatic screen printing machine designed for precise solder paste application on PCBs. This high-precision equipment ensures uniform solder paste distribution for optimal electronic component soldering in SMT production lines.
The T9 solder paste printing machine applies solder paste uniformly onto PCB solder pads using precision scrapers. Its high-precision motion control system ensures accurate coating position and thickness for optimal soldering quality in electronic manufacturing.
- Intelligent PCB thickness adjustment platform with lifting mechanism
- German-made screw rod for stable operation and precise positioning
- China's first online calibration technology
- Advanced 2D inspection system
- Modular design for easy maintenance and operation
- Rack module
- Lifting module
- Platform alignment module
- Housing module
- Image capture module
- Stencil frame positioning module
- Squeegee module
- Display module
- Conveyor module
- Cleaning module
- Air and power input
| Basic Parameters | ||
|---|---|---|
| Screen Frame Size | 650(X)×420(Y) to 1000(X)×880(Y) mm | Thickness: 20-40mm |
| PCB Thickness Range | 0.2mm～6mm | (Use jig when PCB less than 0.4mm) |
| Conveyor Speed | 0~1500mm/sec | Increment 1mm |
| Print System | ||
| Print Speed | 5-200mm/s | Adjustable |
| Scraper Pressure | 0~20kg | |
| Vision System | ||
| Camera | Germany BASLER | 1/3" CCD, 640×480 pixel |
| 2D Detection | Standard feature | |
- Pneumatic Top Clamp for thin PCBs (≤1mm)
- Vacuum adsorption and unloading for FPC applications
- Automatic solder paste addition system
- SPI closed loop monitoring
- Industry 4.0 integration (barcode trace, production analysis)
- UPS power protection (15min backup)
- Gas source: 4.5-6kgf/cm²; Inlet pipe Ø≥8mm
- Power: Single-phase AC 220V±10% 50/60HZ, 4-6mm² power cord with 16A grounded socket
- Floor pressure requirement: 1000kg/m²
- Training: 2-3 personnel required for installation training
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