Dielectric Patch Antennas

Application:

high-power power semiconductor module; Semiconductor refrigerator, electronic heater; Power control circuit, power hybrid circuit. Intelligent power components; High frequency switching power supply, solid state relay. Automotive electronics, aerospace and military electronic components. Solar panel assembly; Telecommunications private exchange, receiving system; Laser and other industrial electronics.

High thermal conductivity, meeting the heat dissipation requirements of devices;

Good heat resistance, meeting the high-temperature (more than 200℃) application requirements of power devices;

Thermal expansion coefficient matching, matching with the thermal expansion coefficient of chip material, reducing packaging thermal stress;

Low dielectric constant, good high frequency characteristics, reducing the signal transmission time of the device and improving the signal transmission rate;

High mechanical strength, meeting the requirements of mechanical properties in the process of device packaging and application;

Good corrosion resistance, able to withstand strong acid, strong alkali, boiling water, organic solution and other corrosion;

Compact structure, meeting the requirements of airtight packaging of electronic devices;