Accurate Machine AOI Automatic Visual Inspection ODM RD30K 220V 5KW Wafer 3x5mil-20x20mil

Name: Accurate Machine AOI Automatic Visual Inspection ODM RD30K 220V 5KW Wafer 3x5mil-20x20mil
Brand: Dongguan MENTO Intelligent Technology Co., Ltd.

The RD30K integrates defective die removal, residue cleaning, solder printing, die bonding, curing, and RGB luminescence inspection. Features laser height measurement, ±10μm mounting accuracy, and dual worktables for non-stop operation. Supports FR-4, BT, glass, and FPC substrates. Custom ODM available.

Place of Origin DONGGUAN

Lighting System LED

Dimensions 1200mm x 1000mm x 1500mm

Model Number RD30K

Supply Ability 10pcs+30 work days

Certification FCC.ROHS,CCC

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Product Description

Model		RD30K
Basic Function	Function	Defective die removing, residues cleaning, solder paste/adhesive printing, die bonding, solder curing, luminescence inspection
	Wafer size	3x5mil-20x20mil
	Substrate compatibility	FR-4, BT substrate, glass substrate, FPC, etc.
	Maximum board size	380mmx280mm
Removing	Removing,method	Physical
	Residue cleaning	Direct removal + heating suction
	Height measurement	Laser measurement 0.001mm
Printing	Motion	XYZ (linear way)
Printing	Adhesive compatibility	Solder Paste, Flux
Chip correction	Correction method	Rotation
Chip correction	Correction angle accuracy	±2°
Mounting	Mounting head	Surface suction
	Mounting strength	25g-210g
	Mounting accuracy	±10μm
Curing	Curing method	Laser, heat curing
Inspection	Inspection items	R, G, B luminescence inspection
Chip table	Accuracy	±0.3 mil
	Re-measurement accuracy	±0.2 mil
	Die attach film size	6"
	Number of die attach films	4PCS
	Ejector stroke	2mm(max)
Specification	UPH	≤30s/pc
	Power	220V±10V,50Hz,5KW
	Dimensions	W1300xD1600xH1650mm
	Weight	1500KG