36 Layer 2 Level HDI Multilayer Metal Core PCB Semiconductor Test Board

Name: 36 Layer 2 Level HDI Multilayer Metal Core PCB Semiconductor Test Board
Brand: Shenzhen Benqiang Circuits Co,Ltd.

High-density 36-layer PCB with 2-level HDI and metal core for semiconductor testing. Supports up to 40 layers, 3/3mil line width/space, and 8OZ copper. Features buried blind vias, rigid-flex, and custom options. Ideal for advanced test applications.

Min width/space 150/95um

Place of Origin Shenzhen, China

Characteristic 2 lasers, aperture ratio 24:1

Packaging Details Air bead vacuum packaging

Material S1000-2m

Model Number FR-4/Rogers

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Product Description

36-layer 2-level HDI version semiconductor test board

Project	PCB process capability
Layer count	1-40 Layers
Min outer line width/space	3/3mil
Outer copper thickness	280um(8OZ)
Inner copper thickness	210um(6OZ)
Tolerance of PCB thickness	board thickness≤1.0mm; ±0.1mm,+/-0.05mm below 4 layers board thickness＞1.0mm; ±10%
Minimum PTH	Mechanical hole 4mil, laser 3mil
Material	FR-4 ,High Tg ,Halogen-free ,PTFE ,Rogers,Polyimide
HDI	Levels 2-7
Special Process	Buried blind vias, blind slots, rigid-flex combination,mixed pressure, back drilling, buried resistance,buriedcapacitance, milling steps, multi-combination impedance;