Blue HDI PCB HASL Surface Finish High Density Interconnect Pcbs

Name: Blue HDI PCB HASL Surface Finish High Density Interconnect Pcbs
Brand: HONGKONG KINGTECH PCB SOLUTION LIMITED

HDI PCB 0.2mm-3.2mm Board Thickness 0.1mm Min. Drilling Hole Wall Thickness HDI- High Density Interconnect PCBsKingtech has a long experience building HDI boards, with a factory base with a deep expertise producing HDI PCBs for different market applications.These factories, combined with our worldwide technical organization, bring a comprehensive knowledge of the requirements and manufacturing methods required for successfulHDI products.What defines a HDI board?IPC-2226

Payment Terms T/T

Place of Origin China

Min. Drilling Hole Wall Thickness 0.1mm

Max. Aspect Ratio 10:1

Delivery Time 2-8working days

Copper Thickness 1/2oz-6oz

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Product Description

HDI PCB 0.2mm-3.2mm Board Thickness 0.1mm Min. Drilling Hole Wall Thickness

HDI- High Density Interconnect PCBs
Kingtech has a long experience building HDI boards, with a factory base with a deep expertise producing HDI PCBs for different market applications.
These factories, combined with our worldwide technical organization, bring a comprehensive knowledge of the requirements and manufacturing methods required for successful
HDI products.
What defines a HDI board?
IPC-2226 defines HDI as a printed circuit board with a higher wiring density per unit area than conventional printed circuit boards(PCB). There are different types of HDI features,
type l, type ll and type lll as defined in IPC-2226.You can ask us about the different types.
Please contact your local NCAB Group company if you need further information or assistance, we are happy to help you.

Technical Parameters:

Parameter	2021	2022	2023
HDI	≤10L ELIC	≤12LELIC	≤14 LELIC
Max.Board Size	540*620	540*620	540*620
Board Thickness	0.24-3.2	0.22-3.2	0.2-3.2
Min. Core Thickness	0.05	0.05	0.05
Min. Laser Drill Hole Size/Pad	0.075/0.225	0.07/0.225	0.07/0.225
Min.Mechanical Drill Hole Size/Pad	0.10/0.35	0.10/0.35	0.10/0.35
Min.Line width/space	0.05/0.05	0.04/0.04	0.04/0.04
BGA Pitch	0.4	0.35	0.30
Copper Thickness	1/3-4	1/3-6	1/3-8
Misalignment of layers	±0.06	±0.06	±0.06
Blind Hole Aspect Ratio	0.8:1	1:1	1:1
Vias Aspect Ratio	10:1	14:1	16:1
Dimple	≤10	≤10	≤10
Warpage	≤0.6%	≤0.5%	≤0.4%
Impedance Control	±10%	±8%	±8%