Fabrication Services Sheet Metal Fabrication

Customized Multilayer Electronic High Frequency PCBs Prototype Fabrication

Name: Customized Multilayer Electronic High Frequency PCBs Prototype Fabrication
Brand: ShenZhen Jieteng Circuit Co., Ltd.

customized PCB prototype circuit board electronic PCB boards fabrication multilayer PCB manufacturing Essential details Model Number: PCB-20 Type: Multilayer pcb Place of Origin: Guangdong, China Brand Name: JIETENG Number of Layers: 40-layer Base Material: FR4/High TG FR-4/M4/ M6/Rogers/Nelco/Isola Copper Thickness: 1 - 4OZ Board Thickness: 0.2 - 4mm Min. Hole Size: 0.15mm Min. Line Width: 0.1mm Min. Line Spacing: 0.1mm Surface Finishing: OSP,Immersion Gold,Immersion Tin

Place of Origin Guangdong, China

Packaging Details Inner vacuum packing, outer standard carton

Material FR4 CEM1 CEM3 Hight TG

Model Number PCB

Supply Ability 150000 Square Meter/Square Meters per Year

Solder mask Green. Red. Blue. White. Black.Yellow

swimsuit high waist bikini bottom high waist dish tv satellite frequency

Product Description

customized PCB prototype circuit board electronic PCB boards fabrication multilayer PCB manufacturing

Essential details

Model Number:: PCB-20

Type:: Multilayer pcb

Place of Origin:: Guangdong, China

Brand Name:: JIETENG

Number of Layers:: 40-layer

Base Material:: FR4/High TG FR-4/M4/ M6/Rogers/Nelco/Isola

Copper Thickness:: 1 - 4OZ

Board Thickness:: 0.2 - 4mm

Min. Hole Size:: 0.15mm

Min. Line Width:: 0.1mm

Min. Line Spacing:: 0.1mm

Surface Finishing:: OSP,Immersion Gold,Immersion Tin,Immersion Ag

Board Size:: 25*15mm

minimum solder resist opening:: 1.5mil

minimum solder resist bridge:: 3mil

maximum aspect Ratio:: 10:01

impedance control accuracy:: ±8%

maximum board size:: 630*1100mm

maximum layer:: 40

Certificate:: ISO9001, ISO16949, ROHS

Surface treatment:: OSP,Immersion Gold,Immersion Tin,Immersion Ag

Item	RPCB	HDI
minimum linewidth/linespacing	3MIL/3MIL(0.075mm)	2MIL/2MIL(0.05MM)
minimum hole diameter	6MIL(0.15MM)	6MIL(0.15MM)
minimum solder resist opening (single-side)	1.5MIL(0.0375MM)	1.2MIL(0.03MM)
minimum solder resist bridge	3MIL(0.075MM)	2.2MIL(0.055MM)
maximum aspect Ratio (thickness/hole diameter)	10:1	8:1
impedance control accuracy	+/-8%	+/-8%
finished thickness	0.3-3.2MM	0.2-3.2MM
maximum board size	630MM*620MM	620MM*544MM
maximum finished copper thickness	6OZ(210UM)	2OZ(70UM)
minimum board thickness	6MIL(0.15MM)	3MIL(0.076MM)
maximum layer	14层	12层
Surface treatment	HASL-LF,OSP ,Immersion Gold, Immersion Tin ,Immersion Ag	Immersion Gold,OSP,selectiveimmersion gold, carbon print
Min/max laser hole size	/	3MIL / 9.8MIL
laser hole size tolerance	/	10%