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Electronic Double Sided Multilayer PCB Printed Circuit Board One Stop Service

Name: Electronic Double Sided Multilayer PCB Printed Circuit Board One Stop Service
Brand: ShenZhen Jieteng Circuit Co., Ltd.

Electronic double-sided multilayer PCB printed circuit board one-stop service other PCB & PCBA manufacturing and assembly Essential details Model Number: PCB PCBA Place of Origin: Guangdong, China Brand Name: JIETENG Base Material: FR-4,FR4,aluminum,Halogen free,High TG etc Copper Thickness: 1/1oz Board Thickness: 1.6mm,2mm,0.2~6mm, 0.4~4.0mm Min. Hole Size: 0.4mm Min. Line Width: 0.2mm Min. Line Spacing: 0.2mm Surface Finishing: OSP, HASL,Immersion gold, Immersion Tin etc,

Place of Origin Guangdong, China

Packaging Details Inner vacuum packing, outer standard carton

Board thickness 0.005"-0.250"

Min. line spacing 4/4mil(0.1/0.1mm)

Model Number PCBA

Supply Ability 80000 Square Meter/Square Meters per Year

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Product Description

Electronic double-sided multilayer PCB printed circuit board one-stop service other PCB & PCBA manufacturing and assembly

Essential details

Model Number:: PCB PCBA

Place of Origin:: Guangdong, China

Brand Name:: JIETENG

Base Material:: FR-4,FR4,aluminum,Halogen free,High TG etc

Copper Thickness:: 1/1oz

Board Thickness:: 1.6mm,2mm,0.2~6mm, 0.4~4.0mm

Min. Hole Size:: 0.4mm

Min. Line Width:: 0.2mm

Min. Line Spacing:: 0.2mm

Surface Finishing:: OSP, HASL,Immersion gold, Immersion Tin etc, HASLOSPimmersion Gold

Board Size:: According to Gerber file

Product name:: Electronic Components Assembly PCB

Keywords:: One Stop Service Oem Pcb Assembly

Material:: FR-4, glass epoxy, FR4 High Tg, Rohs compliant, Aluminum, Rogers, etc

Application:: Electronics Device

PCB type:: Hard, flexible, rigid-flexible

Shape:: Any shape: Rectangular,round,slots,cutouts,complex,irregular, etc

PCBA service:: SMD SMT DIP Component Assembly

Layers	Mass production: 2~58 layers / Pilot run: 64 layers
Max. Thickness	Mass production: 394mil (10mm) / Pilot run: 17.5mm
Material	FR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead free assembly material) , Halogen-Free, Ceramic filled , Teflon, Polyimide, BT,PPO, PPE, Hybrid, Partial hybrid, etc.
Min. Width/Spacing	Inner layer: 3mil/3mil (HOZ), Outer layer: 4mil/4mil(1OZ)
Max. Copper Thickness	UL certificated: 6.0 OZ / Pilot run: 12OZ
Min. Hole Size	Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm)
Max. Panel Size	1150mm × 560mm
Aspect Ratio	18:1
Surface Finish	HASL,Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger
Special Process	Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control