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PCB Electronic Circuit PCB Board Assembly PCBA BOM Processing

Name: PCB Electronic Circuit PCB Board Assembly PCBA BOM Processing
Brand: ShenZhen Jieteng Circuit Co., Ltd.

Specializing in the production of PCB high-frequency circuit board PCBA electronic products development BOM processing Overview Essential details Model Number: Pcba 1002 Type: Home appliance pcba, Smart Electronic pcba Place of Origin: Guangdong, China Brand Name: JIETENG Supplier Type: PCBA Copper Thickness: 1/2OZ 1OZ 2OZ 3OZ Name: Car GPS Tracker PCBA Manufacturer Keywords: One Stop Service Oem Pcb Assembly Number of Layers: 1,2,4,6,up to 26 layers Material: FR-4, glass

Place of Origin Guangdong, China

Packaging Details Outer packing: Standard carton packing,Inner packing:ESD bag.

Min. line spacing 0.075mm

Service One-stop Service

Model Number PCBA 0003

Supply Ability 50000 pieces/month

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Product Description

Specializing in the production of PCB high-frequency circuit board PCBA electronic products development BOM processing

Overview

Essential details

Model Number:: Pcba 1002

Type:: Home appliance pcba, Smart Electronic pcba

Place of Origin:: Guangdong, China

Brand Name:: JIETENG

Supplier Type:: PCBA

Copper Thickness:: 1/2OZ 1OZ 2OZ 3OZ

Name:: Car GPS Tracker PCBA Manufacturer

Keywords:: One Stop Service Oem Pcb Assembly

Number of Layers:: 1,2,4,6,up to 26 layers

Material:: FR-4, glass epoxy, FR4 High Tg, Rohs compliant, Aluminum, Rogers, etc

Application:: Electronics Device

PCB type:: Hard, flexible, rigid-flexible

Shape:: Any shape: Rectangular,round,slots,cutouts,complex,irregular, etc

Board Thickness:: 0.4~4.0mm

PCBA service:: SMD SMT DIP Component Assembly

Certificate:: ISO9001/Iso14001/CE/ROHS

PCB Techinecal Capacity

Layers	Mass production: 2~58 layers / Pilot run: 64 layers
Max. Thickness	Mass production: 394mil (10mm) / Pilot run: 17.5mm
Material	FR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead free assembly material) , Halogen-Free, Ceramic filled , Teflon, Polyimide, BT,PPO, PPE, Hybrid, Partial hybrid, etc.
Min. Width/Spacing	Inner layer: 3mil/3mil (HOZ), Outer layer: 4mil/4mil(1OZ)
Max. Copper Thickness	UL certificated: 6.0 OZ / Pilot run: 12OZ
Min. Hole Size	Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm)
Max. Panel Size	1150mm × 560mm
Aspect Ratio	18:1
Surface Finish	HASL,Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger
Special Process	Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control

PCBA technical Capacity

SMT	Position accuracy:20 um
	Components size:0.4×0.2mm(01005) —130×79mm,Flip-CHIP,QFP,BGA,POP
	Max. component height::25mm
	Max. PCB size:680×500mm
	Min. PCB size:no limited
	PCB thickness:0.3 to 6mm
	PCB weight:3KG
Wave-Solder	Max. PCB width:450mm
	Min. PCB width: no limited
	Component height:Top 120mm/Bot 15mm
Sweat-Solder	Metal type :part, whole, inlay, sidestep
	Metal material:Copper , Aluminum
	Surface Finish:plating Au, plating sliver , plating Sn
Press-fit	Air bladder rate:less than 20%
	Press range:0-50KN
	Max. PCB size:800X600mm
Testing	ICT,Probe flying,burn-in,function test,temperature cycling