Industrial Mechanical Arm Nvidia Jetson TX2 8G Developer Kit Embedded Systems
Industrial Mechanical Arm Nvidia Jetson TX2 8G Developer Kit Embedded Systems CUDA Jetson TX2 NVIDIA Jetson TX2 8G Developer Kit PLINK TX2-DEV Y-C1 Carrier Board, NVIDIA Jetson TX2 Module, Cooling FAN Board size 87mm×60mm×16mm Power requirements +7V~+19V Working temperature -40~+85°C Weight 51g Configurable power-on mode (default is power-on self-start) Onboard encryptor for encryption protection of applications User-accessible on-board tri-color LED indicators within the
Industrial Mechanical Arm Nvidia Jetson TX2 8G Developer Kit Embedded Systems
CUDA Jetson TX2
NVIDIA Jetson TX2 8G Developer Kit PLINK TX2-DEV
Y-C1 Carrier Board, NVIDIA Jetson TX2 Module, Cooling FAN
| Board size | 87mm×60mm×16mm |
| Power requirements | +7V~+19V |
| Working temperature | -40~+85°C |
| Weight | 51g |
Configurable power-on mode (default is power-on self-start)
Onboard encryptor for encryption protection of applications
User-accessible on-board tri-color LED indicators within the operating system
256 core NVIDIA Pascal GPU. Fully supports all modern graphics APIs, unified shaders and is GPU compute capable. The GPU supports all the same features as discrete NVIDIA GPUs, including extensive compute APIs and libraries including CUDA. Highly power optimized for best performance in embedded use cases.
ARMv8 (64-bit) Multi-Processor CPU Complex. Two CPU clusters connected by a high-performance coherent interconnect fabric designed by NVIDIA; enables simultaneous operation of both CPU clusters for a true heterogeneous multi-processing (HMP) environment. The Denver 2 (Dual-Core) CPU clusters is optimized for higher single-thread performance; the ARM Cortex-A57 MPCore (Quad-Core) CPU clusters is better suited for multi-threaded applications and lighter loads.
PLINK AI AND NVIDIA
Plink AI Technology can offer diverse product portfolios that address edge application needs. We are experts in designing carrier boards, and systems, based on NVIDIA products. With that, you can quickly develop edge AI platforms that cater to individual project needs. Enjoying fast time to market, our customers are empowered to rapidly harness the power of AI at the edge.
PLINK AI Solutions
Jetson products are used for Autonomous machines and small computing scenarios, servers are used for large-scale computing. The combination of the two can minimize the cost of hardware products.
| AI Performance | 1.33 TFLOPS |
| GPU | 256-core NVIDIA Pascal™ GPU |
| CPU | Dual-core Denver 2 64-bit CPU and quad-core Arm® Cortex®-A57 MPCore processor |
| Memory | 8 GB 128-bit LPDDR4 59.7GB/s |
| Storage | 32 GB eMMC 5.1 |
|
USB3.0 |
2 |
|
CAN |
2 |
| 3.3V (UART) | 3 |
|
3.3V level Debug |
1
|
| Gigabit Ethernet (10/100/1000 BASE-T) |
1 |
| GPIOs(3.3V) |
4 |
| RTC battery pin header | 1 |
| 621 RTC battery holder |
1 |
| HDMI 2.0 | 1 |
| SD card |
1 |
| I2C(3.3V) |
1 |
|
fan control |
1 |
| Power |
+7V~+19V |
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