Turnkey PCB Assembly 2-64 Layer 0.3-6.5mm Thickness High Quality Custom Design

Name: Turnkey PCB Assembly 2-64 Layer 0.3-6.5mm Thickness High Quality Custom Design
Brand: TONGZHAN INDUSTRIAL LIMITED

High-quality turnkey PCB assembly with 2-64 layers, 0.3-6.5mm thickness, and 0.3-12oz copper. Fast delivery, custom design, and rigorous testing ensure reliability. Materials include FR4, Rogers, and more. Ideal for demanding industrial applications.

Place of Origin China

Surface Finished HASL Pb Free Immersion Gold/Tin/Silver Osp

Keyword Turnkey PCB Assembly

Applications Industrial Control, Medical, Automotive Electronics

Packaging Details PCB + Box

Materials High-Tg FR4, Rogers, Nelco, RCC, PTFE, FR4

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Product Description

Effortless Turnkey PCB Assembly Solutions: Your Path to Project Excellence

Our Advantages And Features:

1. HIGH-QUALITY MANUFACTURING: We employ strict quality control processes to ensure each PCB meets high standards.

2. Fast Delivery: We offer fast delivery options to meet your tight project timeline.

3. Custom Design: Our engineering team will provide personalized PCB design services based on your specific needs.

4. Reliability: Our PCBs are rigorously tested and verified to ensure long-term reliability and stability.

Turnkey PCB Assembly Parameters:

Item	Technical Parameter
Layer	2-64
Thickness	0.3-6.5mm
Copper Thickness	0.3-12 oz
Min Mechanical Hole	0.1mm
Min Laser Hole	0.075mm
HDI	1+n+1,2+n+2,3+n+3
Max Aspect Ratio	20:01
Max Board Size	650mm*1130mm
Min Width/Space	2.4/2.4mil
Min Outline Tolerance	±0.1mm
Impedance Tolerance	±5%
Min PP Thickness	0.06mm
Bow &Twist	≤0.5%
Materials	FR4, High-Tg FR4, Rogers, Nelco, RCC, PTFE, M4, M6, TU862, TU872
Surface Finished	HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion Gold+OSP
Special Capability	Gold Finger Plating, Peelable, Carbon ink

Turnkey PCB Assembly Introduction:

The earliest use of printed circuit boards is paper-based copper-clad printed boards. Since the advent of semiconductor transistors in the 1950s, the demand for printed boards has risen sharply. Especially with the rapid development and wide application of integrated circuits, the volume of electronic equipment is getting smaller and smaller, and the circuit wiring density and difficulty are getting bigger and bigger, which requires the printed board to be updated continuously. At present, the variety of printed boards has developed from single-sided to double-sided, multi-layer boards and flexible boards; the structure and quality have also developed to ultra-high density, miniaturization, and high reliability.