FPC Prototype PCB Assembly Through Hole Multilayer Board 2-68 Layers TU862

Name: FPC Prototype PCB Assembly Through Hole Multilayer Board 2-68 Layers TU862
Brand: TONGZHAN INDUSTRIAL LIMITED

High-reliability FPC prototype PCB assembly with 2-68 layers, through hole, and carbon ink options. IATF16949 & UL certified. Supports SMT with 14M spots/day, 0.3% reject rate, and custom PCB types including rigid-flex and metal base boards.

Place of Origin China

Surface Finished Immersion Gold+OSP, HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp

Keyword Prototype PCB Assembly

Applications Automotive Electronics, Communications

Packaging Details PCB + Box

Materials High-Tg FR4, RCC, PTFE, TU862, TU872

stand up paddle board inflatable home chalk board power bank printed circuit board

Product Description

FPC Boards Prototype PCB Assembly Carbon Ink Through Hole Assembly TU862

Prototype PCB Assembly Description:

1. From prototype to production.

2. 2-68 layers board fabrication.

3. TPS Lean production and high reliability.

4. IATF16949, UL certification.

Prototype PCB Assembly Parameters:

SMT Capability	14 million spots per day
SMT Lines	12 SMT lines
Reject Rate	R&C: 0.3%
Reject Rate	IC: 0%
PCB Board	POP boards/Normal Boards/FPC boards/Rigid-flex boards/Metal base boards
Parts Dimension	Min BGA Footprint:03015 Chip/0.35mm BGA
	Parts SMT Accuracy:±0.04mm
	IC SMT Accuracy:±0.03mm
PCB Dimension	Size:5050mm-686508mm
PCB Dimension	Thickness: 0.3-6.5mm

Prototype PCB Assembly Introduction:

1. After the electronic equipment adopts printed boards, due to the consistency of similar printed boards, manual wiring errors are avoided, and automatic insertion or mounting of electronic components, automatic soldering, and automatic detection can be realized, which ensures electronic products. quality, improve labor productivity, reduce costs, and facilitate maintenance.
2. Provide the required electrical characteristics, characteristic impedance, and electromagnetic compatibility characteristics for the circuit in high-speed or high-frequency circuits.
3. The printed board with passive components embedded inside provides certain electrical functions, simplifies the electronic installation procedure, and improves the reliability of the product.
4. In large-scale and ultra-large-scale electronic packaging components, an effective chip carrier is provided for the miniaturized chip packaging of electronic components.