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Customized FR4 Multilayer PCB Assembly Prototype 550x450mm 0.2mm Thickness

Name: Customized FR4 Multilayer PCB Assembly Prototype 550x450mm 0.2mm Thickness
Brand: Croll Technology (Shenzhen) Co., Ltd.

Custom FR4 multilayer PCB assembly for prototypes and mass production. Supports HDI, rigid-flex, and SMT. UL, RoHS, ISO9001 certified. MOQ 1 pc. One-stop service from PCB to PCBA.

Minimum BGA 0.2mm

Place of Origin China

PCB minimum thickness 0.2mm

Packaging Details Vacuum package+Carton box

Model Number CRT-PPA-004

Supply Ability 50000 pcs/month

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Product Description

Customized Prototype PCB Assembly FR4 Multilayer Circuit Board

PCB Customized FR4 Multilayer PCB Circuit Prototype Printed Circuit Board Assembly

Main Capabilities:

FPC board
Rigid-Flex PCB
Double-sided PCB
Multi-layer PCB
HDI high-density PCB
SMT patch processing services....

Product Image:

Specification:

Process Capability		We provide the following services
PCB maximum size	550x450mm	1. HDI PCB samples, mass production/ PCBA samples, mass production 2. SMT chip processing 3. Plugin processing 4. After welding 5. PCBA semi-finished product production 6. Machine assembly
PCB minimum size	30x30mm
PCB minimum thickness	0.2mm
PCB shape	Unlimited
Whether to support single-sided/double-sided	Yes
Minimum component size	201
Component height	0.2-25mm
Minimum gap	0.5mm
Minimum BGA	0.2mm
Maximum component size	55mmx55mmx15mm
SMT patch part type	SOP, SOT, QFN, QFP, BGA, Bonding
Is it possible to mount the connector	Yes
Whether it can be wave soldered	Yes