High Power SMD5050 DOB AC LED Module Driverless Custom Square Shape
Custom 5050 Square Ac Led Module 220v Driverless DOB High Power Smd Led PCBA Product Description Model MK16H1-126x50-19383 Beam angle 25/30x80/60/90/120/157x85degree Lens size 50x50x10.1mm LED CHIP SMD 5050 Dense array of 96 LED led street light Materical for lens Optical grade PC Lens transmittance 93% Work temperature -40-120 degree Samples Available Delivery time 5-7 work days for 1-1000 pcs TECHNICIAL
High Power SMD5050 DOB AC LED Module Driverless Custom Square Shape
Custom 5050 Square Ac Led Module 220v Driverless DOB High Power Smd Led PCBA
Product Description
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Model |
MK16H1-126x50-19383 |
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Beam angle |
25/30x80/60/90/120/157x85degree |
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Lens size |
50x50x10.1mm |
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LED CHIP |
SMD 5050 |
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Dense array of 96 LED |
led street light |
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Materical for lens |
Optical grade PC |
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Lens transmittance |
93% |
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Work temperature |
-40-120 degree |
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Samples |
Available |
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Delivery time |
5-7 work days for 1-1000 pcs |
TECHNICIAL CAPABILITY:
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Item |
Technical Specification |
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Standard |
Advanced |
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Number of Layers |
1-48 layer |
48-60 layer |
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Laminate |
CEM-3,FR4 (High Tg, Halogen Free),Rogers,Teflon, Arlon, Metal Base (Aluminum, Copper), Mixematerial. |
Thermount |
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Laminate Brand |
KB,Shengyi,Nanya,Isola,Goword,grace,Rogers, Arlon,Taconic,Ventec,Boyu |
customer specify |
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Maximum board size |
610X915mm |
610x1060mm |
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Board thickness |
0.15-4.5mm |
0.13-6.0mm |
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Minimum line width |
4mils (1oz Cu finished) |
3mils(1oz Cu finished) |
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Minimum Line gap |
4mils(1oz Cu finished) |
3mils(1oz Cu finished) |
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Outer layer copper thickness |
1/3-12OZ |
12-16OZ |
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Inner layer copper thickness |
1/3-14OZ |
14-16OZ |
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Min. finished hole size (Mechanical) |
0.20mm |
0.15mm |
|
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Min. finished hole size (laser hole) |
0.075mm |
0.05mm |
|
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Aspect ratio |
10:01 |
12:1 |
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Solder Mask Types and brand |
Nanya,Taiyo |
customer specify |
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Solder Mask Color |
Gloss & matte green |
Red, Black, Yellow, Blue,white |
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Impedance Control Tolerance |
10% |
5% |
|
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Surface Treatment |
Flash Gold |
Au:1-3U'' |
Au: 3U'' |
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Immersion Gold |
Au:2-4U'' |
Au: 2-6U'' |
|
|
Sn/PB HASL |
Sn:100-1000U'' |
Sn: 200-800U'' |
|
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Leadfree HASL |
Sn:100-1000U'' |
Sn: 200-800U'' |
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Immersion Silver |
Ag: 0.15um-0.75um |
/ |
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OSP (Entek) |
Thicknes: 0.20-0.50um |
/ |
|
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Hard Gold Finger |
Au: 30U'' |
Au:30-60U'' |
|
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Hard Gold Plating |
Au-30U'' |
Au:30-60U'' |
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Carbon ink |
|
|
|
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Immsion Sn |
Sn:0.8-1.2um |
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V-Cut |
V-cut degree |
30+/-5 degree |
20,45, 60 Degree |
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Tol: +/-0.13mm |
Tol: +/-0.10mm |
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Chamfer |
The angle type of the chamfer |
20,30, 45 Degree |
/ |
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Plug via hole |
Min. size can be plugged |
0.15mm |
/ |
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Max. size can be plugged |
0.50mm |
0.70mm |
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Min. distance between the IC pads can keep SM bridge |
8mils |
7mils |
|
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Min. SM bridge for green soldermask |
4 mils |
3 mils |
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Min. SM bridge for black soldermask |
5mils |
4mils |
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