High Temperature Resistant Polyimide Electrical Insulation Tape 0.06mm Thickness with 280°C Thermal Rating

Professional-grade polyimide electrical insulation tape with silicone adhesive, offering exceptional thermal resistance up to 280°C and superior electrical insulation properties. Features 0.06mm thickness, high mechanical strength, and resistance to solvents and chemicals. Ideal for SMT soldering, PCB protection, and H-class motor insulation applications.

Place of Origin CHINA
Packaging Details Export carton case
Color Amber transparent
Tape thickness 60um
Model Number K2321
Supply Ability 50,000m2 per month
Product Description
Product Overview

High Temperature Resistant Polyimide Electrical Insulation Tape featuring PI film with silicone adhesive, designed for demanding industrial applications requiring superior thermal and electrical performance.

Material Composition
  • Base Film: Polyimide (PI) Film
  • Adhesive: Silicone Adhesive
Physical Characteristics

Amber transparent appearance with smooth surface, free from creases, bubbles, foreign objects, tearing, and glue layer transfer during unwinding.

Performance Features
  • High mechanical strength and excellent electrical insulation properties
  • Superior dimensional stability and temperature resistance
  • Resistant to solvents and water
  • Long-term working temperature: 220°C, short-term up to 280°C
Industrial Applications
  • Electronic protection during bonding processes including SMT wave soldering and reflow soldering
  • Temperature protection for electronic switches, PCB board gold fingers, SMD transformers, and relays
  • Coil insulation wrapping for H-class motors and transformers
  • High-temperature coil wrapping and thermal resistance protection
Technical Specifications
Parameter Specification
Total Thickness 0.06mm ± 0.003mm
Base Film Thickness 0.025mm ± 0.003mm
Breakdown Voltage ≥5 KV
Insulation Resistance ≥10¹³ Ω
Tensile Strength ≥40 N/10mm
Elongation ≥45%
Adhesion Strength to Steel ≥2.4 N/10mm
Working Temperature Range -73°C to 280°C
Chemical Resistance Bonds well with 20% HCL/NaOH for 10 hours, no delamination or glue transfer
Releasing Film Type 2321: None | Type 2321L: 0.075mm

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