2 Sided Copper Clad PCB Board PCB Component Assembly
FR-4 Double Sided Copper Clad PCB Board PCB Component Assembly Introduction Components could be mounted or soldered on both sides. The double-sided assembly is more frequently used in comparison to the single-sided one. The components are on both sides. We have the equipment to assembly double sided PCBs. Of the double-sided PCB assembly process, the surface-mount components will be placed on both sides of the PCB followed by Through-hole placement. The through-hole component
FR-4 Double Sided Copper Clad PCB Board PCB Component Assembly
Introduction
Components could be mounted or soldered on both sides. The double-sided assembly is more frequently used in comparison to the single-sided one. The components are on both sides. We have the equipment to assembly double sided PCBs.
Of the double-sided PCB assembly process, the surface-mount components will be placed on both sides of the PCB followed by Through-hole placement. The through-hole component placement can only be done after the completion of the surface mounting process on both sides of the PCB.
PCB CAPABILITIES
| FACTORY CAPABILITIES | |||
| No. | Items | 2019 | 2020 |
| 1 | HDI Capabilities | HDI ELIC (4+2+4) | HDI ELIC(5+2+5) |
| 2 | Max layer count | 32L | 36L |
| 3 | Board Thickness | Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm | Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm |
| 4 | Min.Hole Size | Laser 0.075mm | Laser 0.05mm |
| Mechnical 0.15mm | Mechnical 0.15mm | ||
| 5 | Min Line Width/Space | 0.035mm/0.035mm | 0.030mm/0.030mm |
| 6 | Copper Thickness | 1/3oz-4oz | 1/3oz-6oz |
| 7 | Size Max Panel size | 700x610mm | 700x610mm |
| 8 | Registration Accuracy | +/-0.05mm | +/-0.05mm |
| 9 | Routing Accuracy | +/-0.075mm | +/-0.05mm |
| 10 | Min.BGA PAD | 0.15mm | 0.125mm |
| 11 | Max Aspect Ratio | 10:1 | 10:1 |
| 12 | Bow and Twist | 0.50% | 0.50% |
| 13 | Impedance Control Tolerance | +/-8% | +/-5% |
| 14 | Daily Output | 3,000m2 (Max capacity of equipment) | 4,000m2 (Max capacity of equipment) |
| 15 | Surface Finishing | HASL lead free/ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD | |
| 16 | Raw Material | FR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI | |
PCBA CAPABILITIES
| PCBA Capability | ||||||
| Material type | PCB | Components | ||||
| Item | Dimension (Length, width,height. mm) | Material | Surface finish | Chip&IC | BGA Pitch | QFP Pitch |
| Min | 50*40*0.38 | FR-4,CEM-1,CEM-3,Aluminium-based board,Rogers,ceramic plate,FPC | HASL, OSP, Immersion gold, Flash Gold Finger | 1005 | 0.3mm | 0.3mm |
| Max | 600*400*4.2 | |||||
Our SMT capabilities:
SMT Assembly: SMT provides a flexible high technology.
These solutions include:
7 high-speed placement machines,
7 automatic printers with fiducial alignment,
2 X-ray machines,
BGA maintenance machines,
ICT test machines
Our DIP function:
A-8 semi-assembly production line with four wave soldering machines
1 U-shaped automatic assembly line for box-type building products with test stations
High temperature / low temperature aging test furnace B-4 for products required for aging test
With time control and temperature control
All products are 100% inspected and tested during the DIP process
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PCB Assembly Process
1.Solder Paste stenciling---2.Surface Mount Technology (Pick and Place)---3.Reflow Soldering---4.Inspection and Quality Control---5.Through-Hole Component Insertion (DIP Process)---6.Final Inspection and Functional Test
Our advantage
1.Service value
Independent quotation system to quickly serve the market
2.PCB manufacturing
High-tech PCB and PCB assembly production line
3.Material purchasing
A team of experienced electronic component procurement engineers
4.SMT post soldering
Dust-free workshop, high-end SMT patch processing
Double Side PCB Assembly Application Field
Printed circuit boards And PCB Assembly are mainly used for many communication industry, medical equipments, consumer electronics and automobile industry ,automotive electronics , audio and video, optoelectronics, robotics, hydroelectric power, aerospace, education, power supply, printer etc industries.
Our Workshop
Common packaging
1.PCB: Vacuum packaging with carton box
2.PCBA: ESD packaging with carton box
Partner
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