8Layer Qsfp Dd Pcb Electronics Manufacturing
QSFP-DD PCB board,8Layer Plus 2 HDI, gold finger,100G material Thermal Accessory Type Included : Heat Sink Cage Type : Ganged Connector System : Wire-to-Board Sealable : No Connector & Contact Terminates To : Printed Circuit Board Form Factor : QSFP-DD Our PCB manufacturing capabilities enable us to produce a wide range of products, We can make just about any printed circuit board you can think of including HDI PCB, Multilayer PCBs (up to 40layers),High-tech PCB, Thick Copper
QSFP-DD PCB board,8Layer Plus 2 HDI, gold finger,100G material
- Thermal Accessory Type Included : Heat Sink
- Cage Type : Ganged
- Connector System : Wire-to-Board
- Sealable : No
- Connector & Contact Terminates To : Printed Circuit Board
- Form Factor : QSFP-DD
Our PCB manufacturing capabilities enable us to produce a wide range of products, We can make just about any printed circuit board you can think of including HDI PCB, Multilayer PCBs (up to 40layers),High-tech PCB, Thick Copper PCB, Halogen PCB as standard options, and more special PCBs such as Flex-Rigid PCB, aluminum PCB and Rogers PCB.
- Multi-layer PCBs Capability (1 to 40L)
- Controlled Impedance Circuit Boards
- 100% Electrical Testing
- 3 mil Traces/3 mil Spaces
- FR4,Roger,Teflon and others
- Maximum Panel Size: 19.7" x 31.5"
- High Density Interconnect PCBs
- Blind, Buried and Plugged Vias
- Smallest Hole size: 0.1mm/0.004"/4mil
- Lead-Free compliant PCBs
1.Product application
Optical module
QSFP-DD(Quad Small Form-factor Pluggable-Double Density) has a four-channel SFP-DD interface, a single-channel transmission rate of 56Gbps, and a transmission rate of 100Gbps. It is applicable to high-performance switch, router, server and host bus adapter in calculation and telecom application, with enterprise storage, high density, high-speed I/O, and multi-channel interconnection.
Specifications:
| Name | QSFP-DD PCB board |
| Layers | 8 |
| Quality Grade | IPC 6012 Class 2,IPC 6012 Class 3 |
| Material | Tachyon 100G |
| Thickness | 1.0mm |
| Min Track/Spacing | 75um/75um |
| Drilling Size | 0.15mm |
| Solder Mask | Green |
| Silkscreen | White |
| Surface Finish | Immersion gold + ENEPIG |
| Finished Copper | 12um |
| Production time | 10-21 working days |
| Lead time | 2-3 days |
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