Through Hole Structure IC Packaging Tray 129.5x135mm with 49 Cavity Matrix and ESD Protection

Through Hole Structure IC Packaging Trays provide lightweight, moisture-proof protection for electronic components with excellent ESD (Electrostatic Discharge) properties. These trays are engineered for semiconductor wafer dies, bare wafers, and various electronic components.

• Lightweight construction reduces transportation and packaging costs
• Edge chamfer design prevents stacking errors and ensures correct placement orientation
• Superior anti-static performance protects components from electrostatic damage
• High temperature resistance suitable for automated assembly equipment
• Corrosion resistance adapts to various production conditions
• Matrix arrangement design maximizes capacity while protecting components

Manufactured using ESD PC injection molding with special high-temperature resistant plastic. The material surface resistance complies with international standards, effectively dissipating static charge to prevent charge accumulation and high potential differences.

Ideal for semiconductor wafer dies, bare wafers, electronic components, and optical electronic components during production processing, packaging, storage, and transportation cycles.