ODM Custom JEDEC ESD Trays 322.6x135.9mm with 39 Cavity Matrix for Semiconductor Components

Name: ODM Custom JEDEC ESD Trays 322.6x135.9mm with 39 Cavity Matrix for Semiconductor Components
Brand: Shenzhen Hiner Technology Co., Ltd.

Custom JEDEC ESD trays with 322.6x135.9mm dimensions and 39-cavity matrix. ESD-safe polymer construction ensures static dissipation and dimensional precision. Ideal for semiconductor, SMT, aerospace, and military applications with 12 years manufacturing expertise and RoHS certification.

Temperature 80°C~180°C

Place of Origin Made In China

Surface resistance 1.0x10E4~1.0x10E11Ω

Customized service Support standard and non-standard,precision machining

Packaging Details 80~100pcs/per carton, Weight about 12~16kg/per carton, Carton size is 35*30*30mm

Color Black

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Product Description

Custom JEDEC ESD Trays for Semiconductor Components

ODM custom JEDEC trays manufactured to your specifications for high-mix, high-value semiconductor products. These precision trays are engineered for demanding electronic component handling where stability, dimensional accuracy, and automation compatibility are essential.

Industry Applications

Electronic Component Manufacturing Facilities
SMT Assembly Operations
Semiconductor Production Lines
Aerospace Industry Applications
Military Industry Components

Manufacturing Advantages

12 years of specialized experience in ESD tray production
Reliable supply chain and adequate product availability
Professional non-standard customization capabilities
Multiple material options including MPPO, PPE, ABS, PEI, IDP
Compliance with JEDEC antistatic standards
Permanent unitary antistatic protection eliminating static threats

Technical Specifications

Brand	Hiner-pack	Outline Dimensions	322.6 × 135.9 × 12.19 mm
Model	HN19102	Cavity Size	27.4 × 18.4 × 6.4 mm
Package Type	Connector	Matrix Quantity	13 × 3 = 39 PCS
Material	MPPO	Flatness	MAX 0.76 mm
Color	Black	Service	Accept OEM, ODM
Resistance	1.0×10⁴-1.0×10¹¹ Ω	Certificate	RoHS

Product Features & Options

Usage: Packaging of electronic components, optical devices

Features: ESD protection, durable construction, high temperature resistance, waterproof, recycled materials, eco-friendly

Material Options: MPPO, PPE, ABS, PEI, IDP, and others

Color Options: Black, Red, Yellow, Green, White and custom colors

Size Options: Customized dimensions, rectangle and circle shapes available

Mold Type: Injection Mold

Design: Based on original samples or custom designs

Packing: Carton packaging

Lead Time: 5-7 working days (varies by order quantity)

Sample Information

Sample Time: After draft confirmation and payment arrangement

Sample Charges:

Free for stock samples
Custom tray samples negotiated individually

Product Images

JEDEC ESD tray HN19102 for IC chip packaging

Frequently Asked Questions

How can I get a quotation?

Please provide detailed requirements for immediate pricing. Contact via Skype, Email, Phone, or WhatsApp for fastest response.

How long will it take to get a response?

We respond within 24 hours during business days.

What kind of service do we provide?

We offer IC tray design services based on component descriptions and provide complete design-to-shipping solutions.

What are your terms of delivery?

We accept EXW, FOB, CIF, DDU, DDP - choose the most convenient option for you.

How to guarantee quality?

All products undergo strict testing and comply with international JEDEC standards, ensuring 100% qualification rate.