Custom JEDEC IC Component Trays - White Color ESD Protection with 5-7 Day Lead Time for BGA QFP Packaging

Name: Custom JEDEC IC Component Trays - White Color ESD Protection with 5-7 Day Lead Time for BGA QFP Packaging
Brand: Shenzhen Hiner Technology Co., Ltd.

Professional custom JEDEC trays for IC components with permanent ESD protection. Available in white and custom colors using MPPO, ABS, and PEI materials. Supports BGA, QFP, SoC packaging with 12 years manufacturing expertise. JEDEC standard compliant with 5-7 day lead time for reliable electronic component protection.

Temperature 80°C~180°C

Place of Origin Made In China

Surface resistance 1.0x10E4~1.0x10E11Ω

Customized service Support standard and non-standard, precision machining

Color Black, Red, Yellow, Green, White...etc.

Packaging Details 80~100pcs/per carton, Weight about 12~16kg/per carton, Carton size is 35*30*30mm

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Product Description

Custom JEDEC IC Component Trays

Our precision-engineered JEDEC trays provide exact-fit protection for your integrated circuits and electronic components, ensuring optimal ESD protection during storage, handling, and transportation.

Key Features & Advantages

Industry Expertise

12 years of specialized experience in ESD tray manufacturing and design

Custom Design Capability

Professional non-standard customization for all IC packaging types

Material Options

MPPO, PPE, ABS, PEI, IDP and other high-performance materials

Quality Assurance

Compliance with international JEDEC antistatic standards

Technical Specifications

Parameter	Specification
Usage	Packaging of Electronic Components, Optical Devices
Features	ESD Protection, Durable, High Temperature Resistance, Waterproof, Recycled, Eco-friendly
Material Options	MPPO, PPE, ABS, PEI, IDP and others
Available Colors	Black, Red, Yellow, Green, White and Custom Colors
Size Options	Customized Dimensions, Rectangle and Circle Shapes
Mold Type	Injection Mold
Lead Time	5-7 Working Days (varies by order quantity)

Compatible IC Packaging Types

Our custom trays support all major IC packaging formats including BGA, FBGA, LGAQFN, QFP, PGA, TQFP, LQFP, SoC, SiP, and other specialized configurations.

Application Areas

Ideal for IC components, semiconductors, micro and nano systems, sensor ICs, and various electronic assemblies requiring ESD protection.

Quality & Service Commitment

All samples undergo rigorous testing to ensure 100% compliance with JEDEC standards. We provide comprehensive support from initial design consultation through final packaging and shipping.

Product Images