2-inch Waffle Pack IC Chip Tray - 80 PCS Capacity, 0.2mm Flatness, High Temperature Resistant
Custom 2-inch waffle pack IC chip trays with 80 PCS capacity and 0.2mm flatness. Features high temperature resistance (120℃-220℃), anti-static protection (1.0×10⁴-1.0×10¹¹Ω), and compatibility with automation equipment. RoHS certified with OEM/ODM services available for semiconductor and electronic component handling.
Custom 2-inch waffle pack IC chip trays designed for high-value semiconductor devices, featuring precise cavity dimensions tailored to your specific chip size, thickness, and handling requirements.
Maintains structural integrity in 120℃-220℃ baking environments without deformation, ideal for semiconductor packaging and testing processes.
Surface resistance of 1.0×10⁴-1.0×10¹¹Ω ensures static electricity elimination during production, packaging, and transportation.
10×8 cavity configuration (80 PCS capacity) with edge chamfer design to prevent stacking errors and ensure proper placement orientation.
Constructed from PC, ABS, PPE materials with excellent mechanical strength, impact resistance, and chemical corrosion resistance.
| Parameter | Specification |
|---|---|
| Outline Size | 50.7×50.7×4mm |
| Cavity Size | 4.83×3.94×0.65mm |
| Matrix Quantity | 10×8 = 80 PCS |
| Flatness | MAX 0.2mm |
| Surface Resistance | 1.0×10⁴-1.0×10¹¹Ω |
| Material Options | PC, ABS, PPE, etc. |
| Color | Customizable (Standard: Black) |
| Certification | RoHS Compliant |
| Service Options | OEM, ODM Available |
| Size | Material | Surface Resistance | Flatness | Color |
|---|---|---|---|---|
| 2-inch | ABS, PC, PPE, etc. | 1.0×10⁴-1.0×10¹¹Ω | Max 0.2mm | Customizable |
| 3-inch | ABS, PC, PPE, etc. | 1.0×10⁴-1.0×10¹¹Ω | Max 0.25mm | Customizable |
| 4-inch | ABS, PC, PPE, etc. | 1.0×10⁴-1.0×10¹¹Ω | Max 0.3mm | Customizable |
| Custom Size | ABS, PC, PPE, etc. | 1.0×10⁴-1.0×10¹¹Ω | TBC | Customizable |
- Semiconductor wafer die and bare wafer handling
- Electronic components packaging and transportation
- Optical electronic components protection
- High-temperature automation equipment assembly
- Production line turnover and storage operations
We have strong mold manufacturing and product design capabilities, with extensive experience in mass production of various IC trays.
Typically 5-8 working days, depending on actual order quantities.
Yes, we offer samples. Sample availability and cost depend on product value, with shipping costs typically collected or as agreed.
We support Ex works, FOB, CNF, CIF, CFR, DDU, DAP, and other incoterms as agreed.
By sea, air, express, mail, or post, depending on customer order quantity and volume requirements.
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