BGA IC Packaging Black JEDEC Matrix Trays 322.6x135.9mm with ESD Protection 10^4-10^11Ω Resistance
Professional BGA IC packaging trays with ESD-stable surface protection. Features 315-piece matrix capacity, 322.6×135.9mm dimensions, and 1.0×10⁴-1.0×10¹¹Ω resistance. JEDEC compliant, ROHS certified, and available in custom materials and colors for semiconductor and electronic component protection.
Temperature
150°C
Place of Origin
Shenzhen China
Surface resistance
1.0x10E4~1.0x10E11Ω
Customized service
Support standard and non-standard,precision machining
Packaging Details
80~100pcs/per carton, Weight about 12~16kg/per carton, Carton size is 35*30*30mm
Color
Black
Product Description
BGA IC Packaging Black JEDEC Matrix Trays
ESD-stable surface resistance matrix trays provide critical protection for sensitive electronic components by preventing electrostatic discharge damage during shipping, storage, and handling operations.
Product Specifications
| Parameter | Specification |
|---|---|
| Outline Dimensions | 322.6 × 135.9 mm |
| Cavity Size | 10.8 × 5.3 × 1.1 mm |
| Matrix Capacity | 35 × 9 = 315 pieces |
| Material | PPE (ESD Conductive) |
| Surface Resistance | 1.0×10⁴ - 1.0×10¹¹ Ω |
| Flatness | Maximum 0.76 mm |
| Color | Black (custom colors available) |
| Certification | ROHS Compliant |
| Brand/Model | Hiner-pack HN 1837 |
Key Features
ESD Protection
Conductive material prevents electrostatic discharge damage to sensitive components
JEDEC Compliance
Manufactured to international JEDEC standards for quality assurance
High Capacity
315-piece matrix configuration optimizes storage and handling efficiency
Custom Options
Available in various materials, colors, and custom sizes
Material Properties
- ESD Conductive Material (also available in antistatic or standard variants)
- Base materials include MPPO, PPE, ABS, PEI, IDP and others
- Optimized for flexibility, strength, and ESD protection requirements
Applications
- Integrated Circuits (IC)
- Electronic Components
- Semiconductor Devices
- Micro and Nano Systems
- Sensor IC Components
- Optical Devices
Manufacturing & Service
- Injection Mold Production
- Custom Design Services (OEM/ODM)
- Carton Packaging
- 5-7 Working Day Lead Time
- Free Stock Samples Available
Quality Assurance
All products undergo strict testing to ensure 100% qualified rate and compliance with international JEDEC standards.
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Interested in this product?
Contact us now for more details and a custom quote.