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HN2079 Wafer Bare Die Tray 50.7×50.7×4mm with 100 Cavity Matrix for IC Chip Packaging

Name: HN2079 Wafer Bare Die Tray 50.7×50.7×4mm with 100 Cavity Matrix for IC Chip Packaging
Brand: Shenzhen Hiner Technology Co., Ltd.

Professional anti-static wafer bare die tray packaging for semiconductor components. Features 100-cavity matrix, 1.0x10⁴-1.0x10¹¹Ω resistance, RoHS/SGS certification, and permanent electrostatic protection. Ideal for bare die, CSP, KGD, and WSP applications with OEM/ODM customization available.

Place of Origin Made In China

Size 2 Inch

Molding Method Injection Moulding

Packaging Details It depends on the QTY of order and size of product

Color Black

Material ABS

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Product Description

Our wafer bare die tray packaging provides reliable protection and transportation solutions for electronic semiconductor components including bare die, CSP (chip scale packaging), KGD (known good die), and WSP (wafer scale packaging). These anti-static trays feature permanent electrostatic dissipation properties through special polymer chain integration, ensuring consistent performance regardless of environmental conditions.

Product Advantages

12+ years of export experience with global customer base
Professional engineering team and efficient management
Short delivery time with guaranteed quality standards
Small batch production support for initial orders
24-hour professional sales response service
ISO certified factory with RoHS compliance
Excellent mechanical strength and heat resistance
Superior impact and chemical corrosion resistance

Technical Specifications

Parameter	Specification
Brand	Hiner-pack
Model	HN2079
Package Type	IC Parts
Material	PC (Polycarbonate)
Color	Black
Resistance	1.0x10⁴-1.0x10¹¹Ω
Outline Size	50.7×50.7×4mm
Cavity Size	0.7×1.2×0.25mm
Matrix Quantity	10×10=100PCS
Flatness	MAX 0.2mm
Service	OEM, ODM Customization
Certification	RoHS/SGS

HN2079 wafer bare die tray packaging for IC chips showing 100 cavity matrix layout

Customer Services

Sample stock available for product selection assistance
24/7 customer support and technical consultation
Custom product recommendations based on requirements
Free samples provided after mold customization
Multiple shipping methods: sea, air, express, mail
Flexible incoterms: EXW, FOB, CIF, CFR, DDU, DAP

Frequently Asked Questions

Q: Can you do OEM and customized design IC trays?

A: We have strong mold manufacturing and product design capabilities with extensive experience in mass production of various IC trays.

Q: How long is your delivery time?

A: Typically 5-8 working days, depending on order quantity and production requirements.

Q: Do you provide samples? Is it free or extra?

A: Yes, we provide samples which may be free or charged based on product value, with shipping costs collected or as agreed.