China Anti-Static IC Packaging Trays with 1.0×10⁴-1.0×10¹¹Ω Surface Resistance and 0.2mm Flatness for sale
China Anti-Static IC Packaging Trays with 1.0×10⁴-1.0×10¹¹Ω Surface Resistance and 0.2mm Flatness for sale

Anti-Static IC Packaging Trays with 1.0×10⁴-1.0×10¹¹Ω Surface Resistance and 0.2mm Flatness

Custom anti-static IC packaging trays with high-level dustless cleaning technology. Features 10+ years export experience, ISO certification, RoHS compliance, and custom OEM/ODM services. Available in ABS, PC, PPE materials with surface resistance range 1.0×10⁴-1.0×10¹¹Ω for semiconductor and electronic component protection.

Place of Origin Made In China
Size 3 Inch
Molding Method Injection Moulding
Packaging Details It depends on the QTY of order and size of product
Color BLACK
Material PC
Product Description
Anti-Static IC Packaging Trays with High-Level Dustless Cleaning
Hiner Pack specializes in designing and manufacturing custom anti-static IC packaging trays for various electronic components, modules, MEMS devices, and specialized applications. Our solutions integrate advanced engineering principles with material technology to deliver optimal value for your business requirements.
Manufacturing Excellence
Our facility features leading-edge mold processing and injection molding equipment, high-level dustless cleaning systems, and comprehensive testing capabilities. Through strategic partnerships with renowned enterprises and academic institutions, we've established a polymer material R&D base and developed specialized process techniques for semiconductor packaging materials.
Key Advantages
  • 10+ years of export experience
  • Professional engineering team and efficient management
  • Short delivery times with consistent quality
  • Support for small batch initial production
  • 24-hour professional sales support with efficient response
  • ISO certified factory with RoHS compliance
  • Global export network serving USA, Germany, UK, Korea, Japan, Israel, and Malaysia
Application Areas
Electronic component thermoformed packaging trays, semiconductor devices, embedded systems, display technology, micro and nano systems, sensors, test and measurement technology, electromechanical equipment, and power supply systems.
HN1833 Technical Specifications
Parameter Specification
Material PC (Polycarbonate)
Color Black
Size Reference H30-403x32-15(150)
ESD Protection Yes
Custom Sizing Length × Width × Height (customer specified)
Features Durable, Reusable, Eco-friendly, Biodegradable
Performance Specifications
Outline Size Material Options Surface Resistance Flatness Color
2" ABS, PC, PPE, etc. 1.0×10⁴-1.0×10¹¹Ω Max 0.2mm Customizable
3" ABS, PC, PPE, etc. 1.0×10⁴-1.0×10¹¹Ω Max 0.25mm Customizable
4" ABS, PC, PPE, etc. 1.0×10⁴-1.0×10¹¹Ω Max 0.3mm Customizable
Custom Size ABS, PC, PPE, etc. 1.0×10⁴-1.0×10¹¹Ω TBC Customizable
We provide professional design and packaging solutions tailored to your specific product requirements.
Anti-static IC packaging tray with high-level dustless cleaning technology
Frequently Asked Questions
Q1. Do your products get any certificates?
Yes, CE certification for EU market and FDA compliance for USA market.
Q2. Can you do the design for us?
Yes. Our professional team has extensive experience in design and manufacturing. We can transform your ideas into practical solutions, even if you don't have complete design files.
Q3. How long is the delivery time?
Standard products: 5-7 working days. Customized solutions: 20-25 working days.
Q4. Do you arrange shipment for the products?
Yes, for FOB or CIF pricing. For EXW pricing, clients arrange their own shipping.
Q5. How about the documents after shipment?
We provide all original shipping documents including Commercial Invoice, Packing List, Bill of Lading, and required certificates.
Custom IC packaging tray design and manufacturing process

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Interested in this product?
Contact us now for more details and a custom quote.