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Customized Waffle Micro Electronic Component Tray 2-4 Inch ESD Protection 0.2-0.3mm Flatness

Name: Customized Waffle Micro Electronic Component Tray 2-4 Inch ESD Protection 0.2-0.3mm Flatness
Brand: Shenzhen Hiner Technology Co., Ltd.

Structurally standard ESD PC waffle packs designed for micro electronic components with customizable requirements. Features automated loading for parts as small as 0.0005 inches, surface resistance of 1.0×10⁴-1.0×10¹¹Ω, and maximum flatness of 0.3mm. Ideal for wafer dies, PCBA modules, and optical devices with OEM/ODM services available.

Temperature General 80°C~100°C

Place of Origin Made In China

Surface resistance 1.0x10E4~1.0x10E11Ω

Customized service Suitable for all kinds of Bar.Die.Chip devices or parts

Packaging Details It depends on the QTY of order(eg:500Sets of 2Inch series products(Waffle tray+lid+clip:10kg/45*40*30)

Color Black.Red.Yellow.Green.White..etc

electronic repair microscope high speed micro centrifuge silicone micro emulsion

Product Description

Customized Waffle Micro Electronic Component Trays

Structurally standard ESD PC waffle packs designed for micro electronic components with customizable requirements to meet specific packaging needs.

Advanced Packaging Solutions

Waffle packs provide superior packaging for die, die attach preforms, and bond pads. As component sizes continue to shrink, waffle packaging becomes increasingly essential for modern electronics manufacturing.

Key Advantages

Automated loading capability for parts as small as 0.0005 inches
Superior protection compared to taping methods
Ideal for optical applications and sensitive components
Comprehensive transit protection with convenient handling
Perfect for silicon dies from MPW processes

Product Applications

Wafer Die / Bar / Chips packaging
PCBA module component protection
Electronic component packaging
Optical device packaging

Technical Specifications

Outline Size	Material	Surface Resistance	Service	Flatness	Color
2"	ABS, PC, PPE, etc.	1.0×10⁴-1.0×10¹¹Ω	OEM, ODM	Max 0.2mm	Customizable
3"	ABS, PC, PPE, etc.	1.0×10⁴-1.0×10¹¹Ω	OEM, ODM	Max 0.25mm	Customizable
4"	ABS, PC, PPE, etc.	1.0×10⁴-1.0×10¹¹Ω	OEM, ODM	Max 0.3mm	Customizable
Custom size	ABS, PC, PPE, etc.	1.0×10⁴-1.0×10¹¹Ω	OEM, ODM	TBC	Customizable

Additional Specifications

Parameter	Details
Cavity Size	Customized Size
Item Material	ABS / PC / MPPO / PPE (customizable)
OEM & ODM	YES
Item Color	Customizable
Features	Durable; Reusable; Eco-friendly; Biodegradable
MOQ	500 pieces
Delivery Time	8-10 working days (depending on quantity)

Professional Design & Packaging Services

We provide comprehensive one-stop service from design to production to final packaging, ensuring optimal protection for your electronic components.

Customized waffle electronic component tray with multiple cavities for micro parts

ESD protective waffle pack tray for semiconductor components

Frequently Asked Questions

Can you do OEM and customized design IC tray?

We have strong mold manufacturing and product design capabilities, with extensive experience in mass production of various IC trays.

How long is your delivery time?

Typically 5-8 working days, depending on the actual purchase quantity of orders.

Do you provide samples? Is it free or extra?

Yes, we offer samples which may be free or charged according to product value, with shipping costs normally collected or as agreed.

What kind of Incoterm can you support?

We support Ex works, FOB, CNF, CIF, CFR, DDU, DAP and other incoterms as agreed.

What shipping methods do you offer?

By sea, by air, or by express, depending on customer order quantity and volume.