DRAM IC ESD Component Tray 322.6x135.9mm JEDEC Standard for BGA QFN QFP Packaging

Name: DRAM IC ESD Component Tray 322.6x135.9mm JEDEC Standard for BGA QFN QFP Packaging
Brand: Shenzhen Hiner Technology Co., Ltd.

JEDEC-compliant ESD component tray with 322.6×135.9×7.62mm dimensions and surface resistance of 10⁴-10¹¹Ω. Supports BGA, QFN, QFP packaging with multiple material options and custom designs. RoHS certified with 100% quality guarantee for automated electronic component handling systems.

Temperature 100°C

Place of Origin Made In China

Surface resistance 1.0x10E4~1.0x10E11Ω

Customized service Support standard and non-standard, precision machining

Packaging Details 80~100pcs/per carton

Color Yellow

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Product Description

DRAM IC ESD Component Tray for Electronics Parts Packaging

Enhance automation efficiency and component protection with JEDEC-compliant trays engineered specifically for your electronic components.

Key Features

JEDEC international standard compliance with strong versatility
Optimal design provides comprehensive IC protection while reducing transportation costs
Multiple material options to meet specific ESD and process requirements
Support for non-standard format customization services
Compatible with BGA, QFN, QFP, PGA, TQFP, LQFP, SoC, SiP and all packaging methods
Structural design meets automatic feeding system requirements for modernized loading

Applications

Package IC, PCBA module components, electronic component packaging, optical device packaging

Technical Specifications

Parameter	Value
Brand	Hiner-pack
Model	HN1876
Outline Dimensions	322.6 × 135.9 × 7.62 mm
Cavity Size	2.9 × 4.1 × 2.7 mm
Package Type	IC
Material	PC (Polycarbonate)
Surface Resistance	1.0×10⁴ - 1.0×10¹¹ Ω
Color	Yellow
Flatness	MAX 0.76 mm
Certification	RoHS Compliant
Service	OEM & ODM Accepted

Material Options & Baking Temperatures

Material	Bake Temperature	Surface Resistance
PPE	125°C - Max 150°C	1.0×10⁴ - 1.0×10¹¹ Ω
MPPO + Carbon Fiber	125°C - Max 150°C	1.0×10⁴ - 1.0×10¹¹ Ω
MPPO + Carbon Powder	125°C - Max 150°C	1.0×10⁴ - 1.0×10¹¹ Ω
MPPO + Glass Fiber	125°C - Max 150°C	1.0×10⁴ - 1.0×10¹¹ Ω
PEI + Carbon Fiber	Max 180°C	1.0×10⁴ - 1.0×10¹¹ Ω
IDP Color	85°C	1.0×10⁶ - 1.0×10¹⁰ Ω

Custom color, temperature, and other special requirements available upon request.

Yellow JEDEC tray IC chip tray HN1876 model for electronic component packaging

Frequently Asked Questions

How can I get a quotation?

Please provide detailed requirements for immediate pricing. Contact us via Skype, Email, Phone, or WhatsApp for prompt response.

How long will it take to get a response?

We respond within 24 hours during working days.

What kind of service do we provide?

We offer complete IC tray design services based on your component specifications, providing one-stop solutions from design to shipping.

What are your delivery terms?

We accept EXW, FOB, CIF, DDU, DDP - choose the most convenient option for you.

How to guarantee quality?

All samples undergo rigorous testing, and finished products comply with JEDEC international standards to ensure 100% qualification rate.