ESD Waffle Pack Electronic Components Tray 2" 3" 4" Custom Sizes with 1.0×10⁴-1.0×10¹¹Ω Surface Resistance

Durable antistatic ABS waffle pack trays for electronic components with surface resistance of 1.0×10⁴-1.0×10¹¹Ω. Available in standard 2", 3", and 4" sizes with maximum flatness of 0.2mm to 0.3mm. ISO certified and RoHS compliant with full OEM/ODM customization options for global electronics manufacturers.

Place of Origin Made In China
Size All kinds of
Molding Method Injection Moulding
Packaging Details It depends on the QTY of order and size of product
Color Black.Red.Yellow.Green.White..etc
Material ABS.PC.PPE.MPPO...etc
Product Description
ESD Waffle Pack Electronic Components Tray Overview
Durable antistatic ABS waffle pack trays designed for protecting optoelectronic components and electronic devices during transportation and handling. Available in standard 2", 3", and 4" sizes with full customization options.
Product Applications
These injection-molded trays serve as reliable carriers for bare dies, chip scale packaging (CSP), wafer scale packaging (WSP), and known good die (KGD) applications. They provide comprehensive protection during transit while offering handling convenience for optical devices and electronic components.
Key Advantages
  • 12+ years of export experience with global customer base
  • Professional engineering team and efficient management
  • Short delivery time with consistent quality assurance
  • Support for small batch production in initial orders
  • 24-hour professional sales support with efficient response
  • ISO certified factory with RoHS compliant products
  • Global export to USA, Germany, UK, Korea, Japan, Israel, Malaysia
Technical Specifications
Outline Size Material Surface Resistance Service Flatness Color
2" ABS, PC, PPE, etc. 1.0×10⁴-1.0×10¹¹Ω OEM, ODM Max 0.2mm Customizable
3" ABS, PC, PPE, etc. 1.0×10⁴-1.0×10¹¹Ω OEM, ODM Max 0.25mm Customizable
4" ABS, PC, PPE, etc. 1.0×10⁴-1.0×10¹¹Ω OEM, ODM Max 0.3mm Customizable
Custom size ABS, PC, PPE, etc. 1.0×10⁴-1.0×10¹¹Ω OEM, ODM TBC Customizable
Professional design and packaging services available for your specific product requirements.
ESD Waffle Pack Electronic Components Tray showing various sizes and configurations
Frequently Asked Questions
Q: Can you do OEM and customized design IC trays?
A: We have strong mold manufacturing and product design capabilities, with extensive experience in mass production of various IC trays.
Q: How long is your delivery time?
A: Typically 5-8 working days, depending on actual order quantity and specifications.
Q: Do you provide samples? Is it free or extra?
A: Yes, we provide samples. Sample availability and cost depend on product value, with shipping costs typically collected or as agreed.
Q: What kind of Incoterms can you do?
A: We support EXW, FOB, CNF, CIF, CFR, DDU, DAP, and other terms as mutually agreed.
Q: What method can you use to ship the goods?
A: Shipping options include sea freight, air freight, express delivery, and postal services based on order quantity and volume.
Close-up view of ESD Waffle Pack tray showing pocket design and material quality

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