Minerals & Metallurgy Non-ferrous Metal Tungsten Tungsten Sheets

ESD-Protected IC Trays 7.62mm Thick for Wafer and Semiconductor Packaging with 10⁴-10¹¹ Ohm Surface Resistance

Name: ESD-Protected IC Trays 7.62mm Thick for Wafer and Semiconductor Packaging with 10⁴-10¹¹ Ohm Surface Resistance
Brand: Shenzhen Hiner Technology Co., Ltd.

Customizable injection-molded IC trays with superior ESD protection (10⁴-10¹¹ ohm surface resistance) for semiconductor wafers and electronic components. Features 7.62mm thickness, reusable design, CE/FDA certifications, and comprehensive customization options for industrial applications.

Place of Origin Made In China

Size All kinds of

Molding Method Injection Moulding

Packaging Details It depends on the QTY of order and size of product

Color Black.Red.Yellow.Green.White..etc

Material ABS.PC.PPE.MPPO...etc

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Product Description

ESD-Protected IC Trays for Semiconductor Packaging

Our electronic components IC trays provide essential electrostatic discharge (ESD) protection for sensitive semiconductor devices during transportation and handling. These injection-molded trays safeguard wafers, bare dies, and precision electronic components from static damage that can cause short-circuit failures.

Customizable Design Solutions

Our experienced engineering team specializes in semiconductor packaging design, offering comprehensive customization for temperature requirements, ESD properties, color options, and cleanliness classifications. We develop tailored packaging solutions for IC chips, wafers, and precision electronic components.

Technical Specifications

Specification	Details
Surface Resistance	10⁴-10¹¹ ohms
Standard Thickness	7.62mm
Material Options	ABS, PC, MPPO, PPE, and custom materials
Customization	Width, length, thickness, and color customization available
CAD Support	Design files available for customer review
Certifications	CE (EU market), FDA (USA market)

Key Features

Superior ESD protection with controlled surface resistance
Reusable and recyclable construction
Environmentally friendly and biodegradable options
Durable design for multiple use cycles
Professional design services for custom requirements

Ordering Information

Parameter	Details
Minimum Order Quantity	500 pieces
Sample Availability	Free samples from existing products; custom samples available
Delivery Time	8-10 working days (standard), varies by quantity
Payment Terms	Products: 100% prepayment; Mold: 50% deposit, 50% after sample approval
Packing	Carton packaging or customer-specified options

ESD-protected IC tray for semiconductor wafer packaging with anti-static properties

Frequently Asked Questions

Q1. Do your products get any certificates?

Yes, we hold CE certification for the EU market and FDA approval for the USA market.

Q2. Can you do the design for us?

Yes, our professional team has extensive experience in designing and manufacturing custom packaging solutions. We can develop complete design files based on your specifications and high-resolution images.

Q3. How long is the delivery time?

Standard products typically ship within 8-10 working days. Customized solutions may require 20-25 working days depending on complexity.

Q4. Do you arrange shipment for the products?

We handle shipment arrangements for FOB or CIF orders. For EXW pricing, customers or their agents arrange transportation.

Q5. How about the documents after shipment?

We provide all original shipping documents via DHL, including Commercial Invoice, Packing List, Bill of Lading, and any required certificates.