JEDEC IC Trays Protect Semiconductor Components In Packaging And Assembly Processes
JEDEC IC Trays Protect Semiconductor Components In Packaging And Assembly Processes Constructed from high‑performance Mppo material, hold integrated circuit parts securely. Resist high operating heat and block outside contaminants. Maintain stable performance through repeated circulation inside semiconductor workshops. Meet diverse chip layout requirements. Custom cavity development serves as core offering. Adjust cavity dimension, slot quantity and overall tray outline to
Constructed from high‑performance Mppo material, hold integrated circuit parts securely. Resist high operating heat and block outside contaminants. Maintain stable performance through repeated circulation inside semiconductor workshops.
Meet diverse chip layout requirements. Custom cavity development serves as core offering. Adjust cavity dimension, slot quantity and overall tray outline to match varied chip samples and project standards.
Fit mainstream semiconductor production workflows. Keep steady supporting performance for long‑time mass‑use. Bring consistent protection from component loading all the way to finished‑part outgoing shipment.
- Excellent high‑temperature resistance
- Dust reduction and anti-contamination
- Support full cavity custom development
- Secure component retention
- Durable for repeated circulation
| Brand | Hiner-pack | ||
| Material | MPPO | ||
| Color | Black | ||
| Outline Line Size | 322.6×135.9×9.5 mm | ||
| Matrix QTY | 20x5=100 PCS | ||
| Service | Accept OEM, ODM | ||
Suit semiconductor chip packaging and assembly workflows. Hold integrated circuit components steady during automated production operations.
Fit bulk component storage and inter‑workshop transit. Protect delicate chips against dust and scratch. Accept custom modification for special non‑standard chip types.
Get stacked with separating protective boards, then packed into thick carton cases. Lower scratch and collision risks during inner‑site handling.
Support sea, air and express delivery modes. Arrange stable production lead‑time. Adopt reinforced outer package to reduce damage risk for long‑distance overseas shipment.
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Why Choose Us:
- Rich experience in JEDEC / IC / Waffle Pack Trays
- In-house mold design capability
- Fast prototype development
- Strict QC process
- Stable supply for global semiconductor customers
Recommended Products
Video
Video
Video
Video
Video
Video