China JEDEC IC Trays For Secure Semiconductor Component Storage for sale
China JEDEC IC Trays For Secure Semiconductor Component Storage for sale
China JEDEC IC Trays For Secure Semiconductor Component Storage for sale
China JEDEC IC Trays For Secure Semiconductor Component Storage for sale
China JEDEC IC Trays For Secure Semiconductor Component Storage for sale
China JEDEC IC Trays For Secure Semiconductor Component Storage for sale
China JEDEC IC Trays For Secure Semiconductor Component Storage for sale

JEDEC IC Trays For Secure Semiconductor Component Storage

JEDEC IC Trays For Secure Semiconductor Component Storage Searching reliable carriers for sensitive semiconductor chips? JEDEC IC trays built for chip storage and transit. Withstand high working temperature, block dust and physical harm toward delicate electronic parts. Fit varied chip models. Custom cavity layout acts as core service. Adjust dimension, cavity count and heat resistance to satisfy unique project requirements. Work for semiconductor assembling, chip testing and

Ic Type BGA,QFP,QFN,LGA,PGA
Tray Shape Rectangular
Place of Origin China
Color Black
Packaging Details CARTON, PALLET
Cavity Size 28×18.8×3.53 mm
Product Description
JEDEC IC Trays For Secure Semiconductor Component Storage

Searching reliable carriers for sensitive semiconductor chips? JEDEC IC trays built for chip storage and transit. Withstand high working temperature, block dust and physical harm toward delicate electronic parts.

 

Fit varied chip models. Custom cavity layout acts as core service. Adjust dimension, cavity count and heat resistance to satisfy unique project requirements.

 

Work for semiconductor assembling, chip testing and component transit. Keep chips steady through high‑temperature processing. Deliver steady protection in full production flow.

Key Features/ Benefits 
  • RoHS compliant materials
  • Anti‑static property protect chips
  • Customizable cavity design
  • Secure component retention
  • Precise cavities lock components firmly
Specifications
Brand Hiner-pack
Model HN25072
Material MPPO
Package Type JEDEC
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 322.6×135.9×7.62 mm
Cavity Size 28×18.8×3.53 mm
Matrix QTY 5X6=30 PCS
Warpage MAX 0.75mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications

Support semiconductor chip testing and high‑temperature reflow production. Secure electronic parts within automated assembly lines.


Fit mass component transit and warehouse storage. Shield sensitive IC units for local and cross‑border shipment. Deliver custom solution for special chip specifications.

Packaging & Shipping/ Services
Neat stacking with protective separators in carton boxes. Robust outer packaging prevent collision damage. Ship by sea air or express. Maintain stable lead time. Reliable packing lower risks for long‑distance transport.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / Waffle Pack Trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers

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Interested in this product?
Contact us now for more details and a custom quote.