China ESD-Safe IC Chip Tray 50.8x50.8mm Precision Cavity for Semiconductor Storage for sale

ESD-Safe IC Chip Tray 50.8x50.8mm Precision Cavity for Semiconductor Storage

Name: ESD-Safe IC Chip Tray 50.8x50.8mm Precision Cavity for Semiconductor Storage
Brand: Shenzhen Hiner Technology Co., Ltd.

Durable ESD-safe tray with precision cavity layout protects delicate IC chips from shifting and electrostatic damage. Resistance 1.0×10⁴-1.0×10¹¹ Ω, max warpage 0.21mm. ISO certified, RoHS compliant. Custom cavity sizes and OEM/ODM available for automated packaging lines.

Ic Type BGA,QFP,QFN,LGA,PGA

Outline Line Size 50.8×50.8×4 mm

Tray Shape Rectangular

Place of Origin China

Packaging Details CARTON, PALLET

Cavity Size 1.57x0.98x0.41 mm

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Product Description

Secure ESD-Safe IC Chip Trays for Semiconductor Storage

Deliver precision cavity structure to hold delicate IC chips firmly, preventing shifting and electrostatic damage during handling. Built with durable material for consistent performance in industrial environments. Provide reliable ESD protection for sensitive semiconductor components. Seeking secure trays for safe chip storage?

Integrate seamlessly with automated packaging lines and cleanroom workflows. Perform steadily in chip loading, transfer, and inventory management procedures. Adapt smoothly to diverse semiconductor manufacturing scenarios.

Support fully customized cavity size and layout to match specific chip dimensions. Prioritize clean production compatibility. Deliver tailored solutions that optimize packaging efficiency and protect IC chips throughout transit.

Key Features/ Benefits

Durable construction
Precision cavity layout
Durable construction
Protects delicate fine pitch IC components efficiently
ESD-safe design
The factory has ISO certification, and the products comply with the RoHS standard.

Specifications

Brand		Hiner-pack
Model		HN24187
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		50.8×50.8×4 mm
Cavity Size		1.57x0.98x0.41 mm
Matrix QTY		10x10=100 PCS
Warpage		MAX 0.21mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

Support semiconductor die attach, device testing, cleanroom assembly, and precision component kitting operations. Pair seamlessly with pick-and-place machines, Class 100 cleanroom environments, and ESD-controlled production lines.

Also used for finished IC inventory storage, inter-plant component transport, and international shipping of electrostatic-sensitive devices. Serve semiconductor fabs, OSATs, and global electronic component distributors.

Customized Services

Provide fully tailored solutions for ESD-safe IC waffle trays. Modify cavity dimensions, spacing, and layout to fit diverse die sizes and packaging needs.

Utilize high-performance ESD-safe material for enhanced durability. Offer prototype validation and personalized design support to optimize production and shipping workflows.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / Waffle pack trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers