High Capacity JEDEC IC Trays 322.6x135.9mm for Large Semiconductor Modules
High Capacity JEDEC IC Trays feature a deep cavity design and PPE anti-static material for secure placement of large semiconductor modules. Custom pocket options available. Provides stable support and effective transport damage prevention for ESD-sensitive devices.
Ic Type
BGA,QFP,QFN,LGA,PGA
Place of Origin
China
Tray Shape
Rectangular
Packaging Details
CARTON, PALLET
Color
Usually black or dark gray for ESD protection
Cavity Size
48.5x45.5 mm
Product Description
High Capacity JEDEC IC Trays for Semiconductor Modules
High Capacity JEDEC IC Trays are perfectly built for large semiconductor modules. High Capacity JEDEC IC Trays well fit big and thick semiconductor devices, and offer steady and secure placement to keep components in good condition.
High Capacity JEDEC IC Trays come with practical deep cavity design and strong solid structure. High Capacity JEDEC IC Trays deliver stable reliable support for large parts during daily production and handling work.
High Capacity JEDEC IC Trays greatly protect modules from damage in transportation. Custom pocket designs are also provided, bringing flexible practical choices for semiconductor module processing needs.
Key Features/ Benefits
- PPE Anti-Static Material Protection
- Deep Cavity Design for Large Modules
- Strong Stable Structural Support
- Effective Transport Damage Prevention
- Customizable Pocket Cavity Design
- Secure Placement for Thick Devices
Specifications
| Brand | Hiner-pack | ||
| Material | PPE | ||
| Color | Black | ||
| Outline Line Size | 322.6×135.9×10.6 mm | ||
| Matrix QTY | 2x5=10 PCS | ||
| Service | Accept OEM, ODM | ||
Applications
High Capacity JEDEC IC Trays adopt PPE anti-static material. Trays offer reliable IC protection in manufacturing and transport, especially for ESD-sensitive semiconductor devices.
- Power semiconductor modules
- Industrial control IC components
- Large & thick semiconductor devices
- Module packaging, storage and transportation
Packaging & Shipping/ Services
High Capacity JEDEC IC Trays adopt high-quality durable PPE anti-static material for inner packaging. Trays support stable safe stacking and come with buffer protection designs to avoid damage during transportation.
Customized cavity packaging solutions are available for large semiconductor modules. All products are delivered by reliable logistics with full shipment tracking, ensuring safe worldwide delivery.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Why Choose Us:
- Automotive project experience
- In-house mold design capability
- Fast prototype development
- Strict material control
- Stable supply for global semiconductor customers
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Interested in this product?
Contact us now for more details and a custom quote.