Precision JEDEC IC Tray 322.6x135.9x7.62mm for Advanced Semiconductor Packaging

Name: Precision JEDEC IC Tray 322.6x135.9x7.62mm for Advanced Semiconductor Packaging
Brand: Shenzhen Hiner Technology Co., Ltd.

Custom JEDEC IC tray with high-precision cavities for complex IC modules. Features excellent anti-static performance (1.0×10⁴-1.0×10¹¹ Ω), MPPO material, and 490 cavities per tray. Fully customizable per chip design. Ideal for SiP, MEMS, and fine pitch IC packaging.

Ic Type BGA,QFP,QFN,LGA,PGA

Place of Origin China

Tray Shape Rectangular

Packaging Details CARTON, PALLET

Color Usually black or dark gray for ESD protection

Cavity Size 3x3x0.92 mm

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Product Description

Precision Jedec Ic Trays For Advanced Semiconductor Packaging And Complex Ic Modules

Looking for reliable precision JEDEC IC trays for advanced semiconductor packaging? These high-quality JEDEC IC trays are specially made for complex IC module packaging applications.

These custom JEDEC trays feature finely processed high-precision cavities that fit complex IC structures very well. They meet standard JEDEC industry requirements and can be fully customized according to your chip design drawings.

They are widely compatible with modern semiconductor packaging processes, and perfectly meet the packaging needs of SiP modules, MEMS devices and various complex IC modules.

Key Features/ Benefits

Full customization based on chip drawing
High precision cavity for complex IC structures
Excellent anti-static performance
Fast mold development

Specifications

Brand		Hiner-pack
Model		HN24223
Material		MPPO
Package Type		JEDEC
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		322.6×135.9×7.62 mm
Cavity Size		3x3x0.92 mm
Matrix QTY		14x35=490 PCS
Warpage		MAX 0.76mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

This MPPO high-temperature resistant JEDEC IC tray provides full protection for IC chips throughout production, testing, packaging and transportation processes. It features excellent ESD anti-static performance, making it extremely suitable for electrostatic-sensitive semiconductor devices.It is widely applied to these professional semiconductor scenarios:

High-temperature SiP system-in-package packaging processes
Precision MEMS micro-electro-mechanical device packaging & handling
Advanced high-density semiconductor module assembly
Fine Pitch IC chip packaging, testing and carrier storage
High temperature resistant semiconductor manufacturing workshops

Packaging & Shipping/ Services

JEDEC Matrix Trays are packaged in durable, anti-static materials with secure stacking and cushioning inserts. Customized packaging solutions are available upon request. All shipments are tracked and handled by trusted carriers for reliable worldwide delivery.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / waffle pack trays
In-house mold design capability
Fast prototype development
Professional engineering team
Stable supply for global semiconductor customers