High Temp JEDEC Tray 150°C ESD Protection 322.6x135.9mm for AI Chip BGA Packaging

Name: High Temp JEDEC Tray 150°C ESD Protection 322.6x135.9mm for AI Chip BGA Packaging
Brand: Shenzhen Hiner Technology Co., Ltd.

High-temperature JEDEC tray with ESD protection (1E4-1E11 Ω) and heat resistance up to 150°C. Made from premium PEI material, it ensures low warpage and dimensional stability for automated handling. Compatible with ASM/Advantest/YAMAHA machines. Free custom design with 24-hour turnaround. Ideal for AI chips, BGA, and IC packaging.

Ic Type BGA,QFP,QFN,LGA,PGA

Place of Origin China

Tray Shape Rectangular

Packaging Details CARTON, PALLET

Color Usually black or dark gray for ESD protection

Cavity Size 4x5x1.6 mm

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Product Description

High Temp JEDEC Tray with ESD Protection

This JEDEC tray is specially designed for high-temperature semiconductor processes, including wafer baking, burn-in testing, reflow soldering, and AI chip packaging. Made from premium PEI material, it delivers exceptional dimensional stability and precise chip positioning, ensuring seamless compatibility with automated handling equipment throughout production, storage, and transportation, while effectively protecting sensitive ICs, BGA packages, and high-value AI chips from electrostatic damage.

Our JEDEC trays are manufactured in strict compliance with JEDEC industry standards, featuring ultra-low warpage and long-term dimensional accuracy even after repeated high-temperature cycles. We offer free custom design services with a 24-hour turnaround for non-standard sizes and configurations, supporting bulk orders with fast lead times to meet the production needs of semiconductor manufacturing enterprises.

Key Features/ Benefits

Heat Resistance up to 150°C
Stable ESD protection (1E4–1E11 Ω)
Compatible with ASM / Advantest / YAMAHA machines
Low Warpage & High Dimensional Stability
JEDEC standard footprint

Specifications

Brand		Hiner-pack
Model		HN24220
Material		MPPO
Package Type		JEDEC
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		322.6×135.9×7.62 mm
Cavity Size		4x5x1.6 mm
Matrix QTY		13x28=364 PCS
Warpage		MAX 0.76mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

These trays are ideal for electronics manufacturing, assembly lines, cleanroom environments, and automated handling systems. Their versatility extends to acrylic tray displays and inventory management applications.

AI chips / GPU / ASIC
BGA / QFN / IC packaging
Burn-in & baking process
Production line buffering

Packaging & Shipping/ Services

JEDEC Matrix Trays are packaged in durable, anti-static materials with secure stacking and cushioning inserts. Customized packaging solutions are available upon request. All shipments are tracked and handled by trusted carriers for reliable worldwide delivery.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

10+ years semiconductor packaging experience
In-house mold design capability
OEM & ODM customization supported
Consistent quality and stable supply
Daily capacity: 2000+ pcs