2 Inch Waffle Pack Chip Tray 50.7x50.7mm ESD Conductive ABS for Microelectronic Component Alignment

Name: 2 Inch Waffle Pack Chip Tray 50.7x50.7mm ESD Conductive ABS for Microelectronic Component Alignment
Brand: Shenzhen Hiner Technology Co., Ltd.

High-precision 2-inch waffle pack tray with Moldflow-optimized design for superior flatness and dimensional accuracy. Features permanent ESD protection, 250 pockets, and RoHS/ISO certification. Ideal for die sorting, inspection, and automated handling. Supports OEM/ODM customization.

Usage IC/Chip Storage And Transportation

Place of Origin SHENZHEN CHINA

Molding Method Injection Moulding

Packaging Details 500 Pcs/carton(According To Actual Packing）

Color Black

Warpage Max 0.2mm

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Product Description

2 Inch Waffle Pack Chip Trays For Accurate Microelectronic Component Alignment

The High Precision Waffle Pack Chip Tray series is the cornerstone of reliable microelectronic component management, specifically designed for applications where dimensional accuracy is non-negotiable. While many generic carriers suffer from microscopic warping, our 2-inch format trays are engineered to maintain an absolute planar degree throughout their operational lifecycle.
The secret to this stability lies in our advanced manufacturing workflow, which begins with comprehensive Moldflow analysis. By simulating the injection molding process before the first tool is ever cut, our engineers can precisely predict and mitigate potential shrinkage or stress points. This data-driven approach ensures that the uniform pocket matrix remains perfectly aligned with the tray’s external dimensions, creating a predictable interface for both manual inspection and automated handling systems.
Constructed from electrically conductive ABS or PC resins, these waffle packs provide the essential electrostatic discharge (ESD) protection required for sensitive bare die and chip-scale packages (CSPs). The tray's design features a regular pattern of separator ribs that define each pocket, ensuring that even the most fragile 2.5D components are cradled in a secure, movement-free environment. For standard workflows, these trays offer a cost-effective, high-precision solution that adheres to the unofficial industry standards for small-format microelectronics.

Key Features/ Benefits

Advanced Moldflow Optimization
Superior Dimensional Tolerance
Permanent ESD Protection
Material Selection for Stability
Industry-Standard 2×2 Inch Footprint
Stackable Security

Specifications

Brand		Hiner-pack
Model		HN24109
Material		ABS
Tray Type		2-inch Waffle Pack
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		50.7x50.7x4mm
Cavity Size		2.93x1.60x0.61mm
Matrix QTY		13X20-10=250PCS
Warpage		MAX 0.2mm
Service		Accept OEM, ODM
Certifications		RoHS, ISO

Applications

These high-precision carriers are optimized for Back-End Semiconductor Processes where alignment is a primary concern. Key applications include: High-Speed Die Sorting, where the tray’s flatness prevents machine "miss-picks"; Manual and Automated Inspection, providing a stable focal plane for optical equipment; and Kitting for Prototype Assembly, where small quantities of diverse die must be organized and protected. Because of their stable size and reliable protection, they are also widely adopted in Aerospace and Defense microelectronics, where component traceability and physical security are paramount. Whether handled manually in an R&D lab or fed into an automated assembly line, these waffle packs ensure your components remain exactly where they belong.

Customization

We provide deep customization capabilities to adapt our trays to your specific process constraints. Our engineering team can optimize Pocket Geometry, including adding tapered walls or specialized corner relief cuts to accommodate specific component features like solder balls or sensitive pads. While standard trays are for ambient use, we can discuss Material Upgrades based on your environmental needs, choosing between various conductive resins or specialized colors for lot tracking. Customization also extends to the inclusion of Reference Marks or Fiducials molded directly into the tray frame to improve the speed and reliability of automated alignment tools.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Factory-direct manufacturer of JEDEC & IC trays
JEDEC compliant, automation-compatible designs
OEM & ODM customization supported
Consistent quality and stable supply
Trusted by global semiconductor customers