Durable JEDEC IC Tray for Modules and PCBs 322.6x135.9mm ESD-Safe Customizable Pocket Layout

Name: Durable JEDEC IC Tray for Modules and PCBs 322.6x135.9mm ESD-Safe Customizable Pocket Layout
Brand: Shenzhen Hiner Technology Co., Ltd.

This JEDEC matrix tray accommodates larger modules and PCBs with ESD-safe MPPO polymer construction. Features secure part retention, automation-optimized design with chamfered corners, and reliable stacking. Customizable pocket layout, color, and molded identification available. RoHS and ISO certified.

Place of Origin SHENZHEN CHINA

Molding Method Injection Moulding

Packaging Details 70~100pcs/carton(According To The Customer Demand）

Color Black, Red, Yellow, Green, White, Etc.

Material MPPO

Model Number HN24137

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Product Description

Durable IC Tray For Modules And PCBs JEDEC Format with Customizable Pocket Layout

This JEDEC matrix tray for modules is designed to accommodate larger or hybrid electronic assemblies while maintaining the same reliability and protection as standard IC trays. Constructed from durable, ESD-safe polymer, it ensures secure handling and transport of modules through automated assembly, testing, and storage processes. The tray's uniform pockets and integrated orientation markers help maintain consistent placement and alignment, while its robust stacking design enhances storage efficiency and safety during operations.

Features & Benefits:

Module-Compatible JEDEC Outline – Conforms to JEDEC standards while providing larger pockets suited for module-level assemblies.

ESD-Safe Construction – Conductive polymer material protects sensitive modules from electrostatic discharge throughout handling and processing.

Secure Part Retention – Pockets are molded to maintain modules in a stable position, reducing movement and potential damage during automation.

Automation-Optimized Design – Includes chamfered corners, and orientation guides for seamless robotic handling.

Stacking Reliability – Interlocking perimeter features ensure trays remain stable when stacked, minimizing the risk of slippage or tipping.

Durable and Long-Lasting – Maintains shape and structural integrity even under repeated handling, moderate process temperatures, and automated workflows.

Technical Parameters:

Brand	Hiner-pack
Model	HN24137
Material	MPPO
Package Type	Module
Color	Black
Resistance	1.0x10e4-1.0x10e11Ω
Outline Line Size	322.6x135.9x7.62mm
Cavity Size	4342.52.7mm
Matrix QTY	2*6=12PCS
Flatness	MAX 0.76mm
Service	Accept OEM, ODM
Certificate	RoHS, IOS

Applications:

This tray is ideal for module-level assemblies, including hybrid IC modules, small PCBs, and other integrated assemblies. It is widely used in automated assembly lines, testing setups, and packaging processes, ensuring safe handling, accurate orientation, and efficient transfer of larger components. The tray facilitates workflow continuity from production to storage, supporting both manual and robotic operations.

Customization:

Flexible customization options allow this tray to meet specific module requirements:

Pocket Layout Adjustments – Modify pocket size, spacing, or contour to accommodate custom module geometries.

Color Options – ESD-safe materials available in multiple colors to differentiate part types or production stages.

Molded Identification – Permanent codes, batch numbers, or logos can be integrated into the tray for traceability.

Automation Interface Adaptation – Add indexing features, tabs, or cutouts to improve compatibility with specialized handling or feeding systems.